Electronics Forum: class 2 bare pcb (Page 1 of 17)

class 2 vs class 3 cost for assembly

Electronics Forum | Mon May 04 06:31:50 EDT 2020 | jandon

Are you capable of doing Class 3 products? Does the design, bare PCB board and assembly meet the requirements of Class 3?

Can I apply IPC-610 class 3 workmanship standards to an assembly made with a IPC-600 class 2 PCB?

Electronics Forum | Thu Feb 05 14:30:29 EST 2015 | chsravan

Can I apply IPC-610 class 3 workmanship standards to an assembly made with a IPC-600 class 2 PCB?

Can I apply IPC-610 class 3 workmanship standards to an assembly made with a IPC-600 class 2 PCB?

Electronics Forum | Fri Feb 06 18:32:59 EST 2015 | chsravan

Hi Scott,Thank you for the response. I was also thinking the same that the assembly will no longer be Class III. Thanks again.

Can I apply IPC-610 class 3 workmanship standards to an assembly made with a IPC-600 class 2 PCB?

Electronics Forum | Fri Feb 06 11:11:04 EST 2015 | mascott123

I have asked that same question to a co-chair of the J-STD-001 committee who in turn checked with personnel at IPC. The answer I received is that yes you can apply the Class 3 assembly requirements using a class 2 PWB but the resultant assembly will

Re: bare board problem

Electronics Forum | Thu Jun 17 21:24:32 EDT 1999 | Dean

| first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads. an

Solderability test method (LF) for bare PCB brd

Electronics Forum | Mon Jan 23 03:12:13 EST 2006 | adeline_ko

The FA department is using IPC or J-STD-003 to do the solderability test for the leaded PCB FA qualification. Class A. However, there is no mention of Lead free testing for the PCB bare brd. Can anyone advise whether IPC has release a solderability

defects in pcb manufacturing

Electronics Forum | Mon Nov 02 07:16:47 EST 2009 | umar

Base on the top picture condition, seems like the boards condition is a lot with solder splash or solder ball which is per IPC-610 is under reject (under 5.6.2)for class 3 product. While the picture 2 is showing those the solder resist is not melt pr

Fuji cp43 pcb layout

Electronics Forum | Fri Oct 31 18:08:34 EDT 2008 | m79d

thank you both for the input ok so i understand the hole is on a 5mmx5mm center the pin seems to be 3mm. About 3mm of the board goes under the clamp rail so the tooling strip must be wider than 5mm as the fiducial also needs to be on it. Mark_m yo

Stencil alignement using the 2 cameras

Electronics Forum | Tue Apr 15 14:10:30 EDT 2003 | russ

here is how it is done. 1.Position the stencil in the machine. 2.Position the board onto the PCB tooling as close to being aligned with the stencil as you can. 3.Place mylar or some thin clear material over the board. your printer should have prov

layer 2 groundplane disconnects after hand solder

Electronics Forum | Fri Apr 10 18:51:39 EDT 2009 | boardhouse

Hi Jeff, Your board supplier could be correct in this way. The board could have had just a hair left of copper on the circuit, which would hold up under the electrical test process, but once you powered it up, then there was enough juice to burn th

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