Electronics Forum | Mon Oct 16 17:46:49 EDT 2006 | Dan
Recently I was given a bad Bios Link from Toshiba which fried my Bios and now my laptop boots to a black screen. I recently unsoldered and removed the existing Bios chip and have ordered anotherfor replacement. Unfortunately while removing, i damag
Electronics Forum | Tue Apr 13 11:41:18 EDT 2021 | jeremy_leaf
I have a SAC305 preform with which I am attempting to bond a gold coated component to an ENIG coated PCB pad. I've specified 2 microinches of gold for the ENIG. It worked previously but now with a new batch of boards, I am having an issue where the p
Electronics Forum | Thu May 05 16:18:47 EDT 2005 | jimmiem
The black pads that we see are on the BGA component. We removed the component from its site and on 2-3 pads 100% of the ball stuck to the pad on the PCB and the corresponding BGA pad was black.
Electronics Forum | Thu May 05 12:22:01 EDT 2005 | jimmiem
could there have been a solderablity issue with that pad to begin with, allowing the flux in (from improper cleaning of adjacent work) to expadite an error may have happened later down the road?
Electronics Forum | Wed May 04 13:13:43 EDT 2005 | Jimmie
We have seen the black dot on the BGA pad after the component has been removed from a PCB. When most likely could this corrosion have occurred, while the component was in storage, during manufacturing of the unit? We have a number of these BGA's th
Electronics Forum | Thu Aug 21 22:10:07 EDT 2003 | adlsmt
Well, for some reason the board house will pay for the boards but has some issue with paying for the parts on them. Why am I not supprised? Perhaps I have mis-diagnosed the problem. We have found two different board p/n's with the same type of defec
Electronics Forum | Thu May 05 12:31:27 EDT 2005 | russ
Not in this case, these BGAs were lead free and the profile used was for a lead part. I guess I will give you the whole story. These boards were sent to us from a customer to have the BGAs replaced for an unknown to us reason. We removed the parts
Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef
Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept
Electronics Forum | Tue May 21 00:24:34 EDT 2002 | ianchan
yngwie, Hi mate, and Holy Crap! what a blooming pile of 7 feet dung you have sitting on your front lawn! ok, we had a customer SQE like that before, fortunately she was promoted from SQE to purchasing officer. and in the name of universal sharing,
Electronics Forum | Fri May 23 23:58:48 EDT 2014 | edriansyah
Hi Hege. I was not also too confident with the black pad (coz no black residue on the remaining pad). But based on my search on the internet regarding black pad. Most of them shows a very clean BGA Pad after peel off the BGA as the picture reference
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