Electronics Forum: cleaning boards between reflowing sides (Page 1 of 43)

Solder not reflowing properly

Electronics Forum | Mon Aug 25 15:40:58 EDT 2008 | dyoungquist

I am seeing poor quality solder joints, mostly on 0402 components. The problem is that while the pad on the pcb is getting fully wetted, the solder is not flowing up the sides of the 0402 component, i.e. the 0402 lead is somewhat de-wetting. The re

pcba cleaning

Electronics Forum | Tue Oct 29 04:40:42 EDT 2019 | jags

how long i can keep pcba after bottom reflow soldering to top side reflow soldering. like 12 hours or 24 hour or 48 hours........Enig board. leadfree soldering with 10% flux

cleaning NO clean

Electronics Forum | Tue Sep 17 15:59:48 EDT 2002 | Randy V

No-Clean fluxes are difficult to clean off boards. Cleaning effectivness depends on the washer, the chemistry, the flux type, number of reflows, and the time between reflow and washing. White residue is flux residues that have started to break down b

PCB post reflow cleaning

Electronics Forum | Sun Mar 28 22:17:36 EST 2004 | Grant Petty

Hi, I would also be interested in this thread, but our problem has a different twist to it. We have good results from our reflow with Koki no clean paste, however when we pass the boards through the wave solder machine, the flux in that leaves a fog

Conformal coating IS-410 boards

Electronics Forum | Sat Apr 21 08:26:57 EDT 2007 | Cmiller

Has anyone experienced a problem with conformal coating adhesion to IS-410 boards? We are having problems with one suppliers boards. IS-410 boards from other suppliers are fine and all FR-4 boards that I have looked at are fine. We are using Conap

Comparison between Glue & solderpaste process

Electronics Forum | Sat Jun 22 21:06:27 EDT 2002 | jersbo

I agree with PJC.. The mention of 2 QFPs to wave = more than likely rework to remove bridges and a potential to scrap the board, 25mil isnt as bad as 20 or less.. but the potential is still very real.$$$$$$ reflow/reflow is my 2 cents with the possib

Comparison between Glue & solderpaste process

Electronics Forum | Fri Jun 21 12:59:20 EDT 2002 | stepheno

When you say well designed for wave, does that include "extra" solder pads for the IC's for solder thieving? And Boards that are well designed for wave don't have QFP's on the bottom. They might be ok but then the board would be "ok for wave", but no

Comparison between Glue & solderpaste process

Electronics Forum | Thu Jun 20 16:59:57 EDT 2002 | davef

We look at gluing and pasting second side components as two different processes, NOT alternative processes. Given our drothers, we'd paste / place / reflow all day long, before we'd want to glue. We glue because we have to glue. The main driver to

Differences between screen and stencil printing

Electronics Forum | Thu Dec 16 15:00:20 EST 2004 | glaucon

Simple differences. Both processes require a very similar machine platform, controlled motion, vision fiducial recognition and alignment of a substrate (PCB or hybrid ceramic) to the "image", the image being either a stencil (hence stencil printing)

Foam fluxer maintenance, storage and cleaning

Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef

Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept

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