Electronics Forum: cleaning osp (Page 1 of 10)

osp finish

Electronics Forum | Wed Jan 21 09:36:52 EST 2004 | davef

As with noclean flux, OSP will fill your probes with crunchy [maybe gummy] stuff. Consider: * Increasing frequency of probe maintenance * Talking to your probe supplier about alternate probes that self-clean better

N-tech osp problems

Electronics Forum | Tue Sep 26 08:41:27 EDT 2000 | greg

I am processing PCB's that have an n-tech osp coating and am finding huge inconsistencies in wetting. Some boards process clean with good wetting and the next has terrible wetting. The boards are stored and handled properly. Has anyone had this

OSP with no clean fluxes

Electronics Forum | Fri Jun 19 18:44:23 EDT 1998 | Steve

Does anyone have wave solder experience using OSP and VOC free no clean flux?

How do you clean OSP PCB's without washing it off?

Electronics Forum | Thu Sep 14 18:00:10 EDT 2006 | slthomas

Is it your normal process to wash all your bare boards or is this in response to something abnormal? Seems like something your suppliers should be taking care of, especially with a non-washable treatment. In answer to your question, I have no idea!

No Clean OSP process cause ICT testing issue due to Flux building in testvia hole

Electronics Forum | Fri Mar 29 07:53:12 EDT 2019 | davef

Why are you printing paste on test via? In the old days, we probed soldered pads to cushion impact force of probing. Is that still a reasonable practice?

No Clean OSP process cause ICT testing issue due to Flux building in testvia hole

Electronics Forum | Wed Apr 03 19:02:16 EDT 2019 | SMTA-Vikram

We still use Via as test points. so we need to paste Via. Pasting will make better contact with probes compare to test via without solder.

No Clean OSP process cause ICT testing issue due to Flux building in testvia hole

Electronics Forum | Thu Apr 11 00:58:44 EDT 2019 | SMTA-Vikram

Thanks for info regarding rotating probe head. We do not recommending to use this probes as it may damage bare board as it will pierce thru board and will shorted etches.. Avoid using this probe for PWBA

No Clean OSP process cause ICT testing issue due to Flux building in testvia hole

Electronics Forum | Fri Jun 07 05:19:23 EDT 2019 | gregoryyork

dont usually see this unless the Rosin hasnt been hardened due to low reflow or excessive pressure on blades squeezing flux out so you have flux rich areas. Are these boards also flow soldered?

No Clean OSP process cause ICT testing issue due to Flux building in testvia hole

Electronics Forum | Fri Mar 29 00:18:05 EDT 2019 | SMTA-Vikram

3% NDF. We using 8oz 90 degree blade type razor probes, still same issue. Is there stencil we can use or selective pasting test via so flux will not build in testvia. any help or guidance will be appreciate.

No Clean OSP process cause ICT testing issue due to Flux building in testvia hole

Electronics Forum | Thu Apr 11 00:54:49 EDT 2019 | SMTA-Vikram

Yes, we have try different Flux, probes. etc... also not to paste vs Paste Via, but still we have ~3% NDF due to contact issue. I am looking for selective pasting with less flux dispenser.Any idea or anyone has used? What about plug via before pas

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