Electronics Forum | Wed Jul 21 17:49:52 EDT 2004 | jsk
problem: Too many solvents and boards are not clean Flux remains on the board after vapor degreaser and "Powdery" white residue after vapor degreasing Flux type is kester 186 Process: hand solder High Temp alloy, spot clean after hand solder e
Electronics Forum | Fri Jul 23 14:41:41 EDT 2004 | Steve Stach
Dear JSK, It sounds like the root causes of your problem are two fold. First, excessive heat will polymerize the abietic acid found in rosin forming neo-abietic diamers and polymers which are much less soluble than the parent monomer. There are
Electronics Forum | Wed Oct 17 19:37:34 EDT 2001 | mparker
Duh?? white residue??? could be the source of anthrax
Electronics Forum | Wed Oct 17 19:12:32 EDT 2001 | scott
Dave's right! Wash the boards RIGHT AFTER reflow, don't let that residue harden. Then you turn around and cure that stuff during the second reflow by not performing the first wash???? wow.... By the way, are you having any problems with white resi
Electronics Forum | Wed Oct 17 13:02:41 EDT 2001 | Yngwie
We are running Clean process. solder beadings were found after the wash process. Weird eh!! It's true.. Details: 1)wash pressure ? No shadowing effects from high profile component. It also happened on the component's body of the 1210 & 0402 caps whi
Electronics Forum | Wed Oct 17 17:43:27 EDT 2001 | davef
2) Open time: A 15-minute queue between paste, place, and reflow SB fine, assuming humidity is not too great. 3) Wash temperature: Yes. A wash temperature of 130-140�F SB fine. 4) Reflowed board was left too long prior wash: Are you washing: * After
Electronics Forum | Thu Oct 18 11:20:21 EDT 2001 | davef
Ooooo, you do have the toys, baybeee!!!! This really is not a good situation. * Leaving this OA flux res on your boards will surely affect the LT performance of your product. * That a rookie found this by noticing solder balls all over the seconda
Electronics Forum | Thu Oct 18 06:29:20 EDT 2001 | Yngwie
Dave, yes, your assumption is right, We only do washing after the second reflow. The timing from the post primary reflow to wash is no longer than 2 hour. The line config is as such : DEK265 � 3x MV2F- 1x MSF � BTU - AOI � DEK265 � 3x MV2F � 1x MSF-
Electronics Forum | Thu Mar 17 22:14:42 EST 2005 | Chua
Hi Davef, Thanks for your advise...... We are running no-clean process. If there is white residues after few days.....is it cause by those excess flux. Thanks
Electronics Forum | Wed Apr 05 11:55:28 EDT 2006 | Cristina Oanca
I am working on a Substrate attach process. The package is gold plated, the preform is AuSn and the backing on the substrate is PdAg. I am using a Sikama reflow furnace. The profile has a 50 sec dwell time. I am over 280 degees C for a little over 1
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