Electronics Forum: cleaning solder joint (Page 1 of 541)

solder joint appearance

Electronics Forum | Thu Jul 29 21:11:13 EDT 2004 | davef

Could be lots of things. With limited information about temperatures, solder alloy, and cleaning; we'll swing for the fence that you got these solder connections very hot. So hot that Pb oxide is dominating the solder joint surface instead of the

bulbous joint

Electronics Forum | Mon Feb 23 20:19:15 EST 2004 | greg york

Has anyone ever seen a bulbous joint (on 1 side > of 1 designator) on every board? I checked the > preheat profile at the wave and have played with > dwell times but can't get rid of it. I checked > the archives and didn't find much. Any help wou

Post reflow solder joint inspection

Electronics Forum | Mon Feb 02 22:01:24 EST 2004 | Dean

I find this disturbing when customers dictate your process and equipment? Your responsibility is to deliver a quality product on time. Why would your customer care HOW you achieve this? Hence the success of Chinese manufacturing. I have one custo

solder joint problem

Electronics Forum | Fri Jul 26 08:25:25 EDT 2013 | emeto

If there is a way to pre-tin the parts, that might help in forming better joint with gold.

SMD solder joint calculation

Electronics Forum | Terry Burnette |

Wed Jan 16 15:21:48 EST 2002

solder joint problem

Electronics Forum | Fri Jul 26 05:14:38 EDT 2013 | anilw2006

We had a solder joint problem in gold plated PLCC68 ic. We do double sided reflow process with Cookson OL107F paste. First we do top with paste and second with glue process.The solder joint shape and wetting looked normal.In the process of testing

Reliability of solder joint

Electronics Forum | Thu May 26 21:09:01 EDT 2005 | thaqalain

The reliability of a Gullwing component solder joint is in question when insufficient solder is evident: *at the heel of the lead *at the toe of the lead *none of the above

SMD solder joint calculation

Electronics Forum | Wed Jan 16 11:20:52 EST 2002 | bentzen

Hi... We tend to do a lot of footprint calculating for new SMD components. But what about the amount of solder paste on the solder pads. The amount of solder alloy is of cause determined by the stencil aperture size, stencil thickness and the sold

SMD solder joint calculation

Electronics Forum | Wed Jan 16 12:04:45 EST 2002 | dason_c

You can use the IPC-7525, Stencil Design Guidelines for start up.

solder joint problem

Electronics Forum | Mon Jul 29 05:48:35 EDT 2013 | anilw2006

Thanks for support. Is it any special process of pre-tinng? Regards, Anil wagh.

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