Electronics Forum: cleaning solder joint (Page 2 of 541)

solder joint failure analysis

Electronics Forum | Tue Feb 08 04:27:55 EST 2011 | thomas111

hi, I am a Hardware designer . One of my products is undergoing a Reliability test in which a resistor shows a high value on board from its specified value .However it retains the original value when its cooled under room temperature. The resistor

BGA solder joint integrity

Electronics Forum | Tue Jan 15 12:20:16 EST 2002 | cfraser

This sounds like it could possibly be a case of Black Pad. We have had a few issuses with this in the past as well. Who the PWB vendor? I also recommend searching the archives and doing some solder samples with nonpopulated boards

BGA solder joint integrity

Electronics Forum | Tue Jan 15 09:42:40 EST 2002 | davef

Here's two choices. 1 Before accepting a lot of boards from your supplier: * Print some paste on a board * Reflow the paste * Inspect the quality of the solder connection * Make a decision on accpting the board based on that observation. 2 Have yo

solder joint problem?

Electronics Forum | Mon Jun 12 06:45:10 EDT 2000 | kim ji tae

Hi! Thanks all who upgrade these pages. I have some questions. Is there any answer? I do double-sided reflow solderig, with 0.4% AG solder cream. with AU finished pcb. First I do reflow solder bottom side where 0.5pitch TQFP locates. Second I do re

BGA solder joint integrity

Electronics Forum | Fri Feb 01 11:58:28 EST 2002 | Romain

the PCB vendor is Multek in germany he made some measures about P content in Ni layer. What is the normal level of Phosporous and what is the upper limit ? thanks Romain

solder joint appearance

Electronics Forum | Wed Jul 28 17:34:27 EDT 2004 | Steve Stach

Hi Ralf, This discoloration may be re-oxidation. Fluxes are supposed to do three things (1) remove oxide, (2) promote wetting, and (3) protect surface from reoxidation. The solder paste possibly is not protecting from reoxidation. Best Regards, St

SMD solder joint calculation

Electronics Forum | Wed Jan 16 20:06:09 EST 2002 | davef

No, not as such. Consider: * Using the IPC calculator [free at http://www.ipc.org]. It allows you to consider / assess the amount of solder when designing pads. * Reviewing IPC-7525 - Stencil Design Guidelines. It gives general aperture guidelines.

Re: solder joint problem?

Electronics Forum | Mon Jun 12 22:00:51 EDT 2000 | Dave F

Could be. What are your profiles? 2) Au finish fail => Could be, but that the connections can be made with hand soldering makes this a low probability cause, assuming the activity of the flux used in hand soldering is not significantly different fr

Re: solder joint problem?

Electronics Forum | Wed Jun 14 18:21:23 EDT 2000 | Robert Moore

It has been our experience that the problem you have discribed was not solder process related. We had two such instances in the past and both were component related. The first case involved a PLCC28 that failed test. Reflowing the solder seemed to co

Insufficient solder joint

Electronics Forum | Tue Dec 14 10:36:42 EST 1999 | Paul Peterson

I recently encountered reflow soldering defects on a pair diode package, the smd pad had a green contamination, I'm convinced that this is not oxidation. The no-solder condition appears to be caused by a sloppy soldermask process, although over the y


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