Electronics Forum | Tue Jun 26 09:37:28 EDT 2001 | Steve Vargas
We are interested in doing some further studies on our cleaning process, particularly with respect to how well we can clean underneath low profile components. As an SMT subcontractor, we'd ideally like to qualify our chemistry/cleaning process to cer
Electronics Forum | Tue Aug 21 21:39:19 EDT 2001 | davef
1) why is No-clean (NC) the preferred process, for BGA mounting by SMT? Probably the same reason NC is the preferred process for mounting non-area array SMT components. 2) why is water-soluble (WS) not a hot choice? There�s not reason not to use
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