Electronics Forum | Fri Sep 16 13:03:11 EDT 2005 | james
We current use glue on our bottom side boards using stencils and screen printers. Our Glue aperatures that we use are very small rectangles and they seem to clog very easily. We currently are using Heraeus PD955PR #8 and see alot of boards that ar
Electronics Forum | Wed Mar 02 06:15:56 EST 2005 | adlsmt
Russ, are you using any reduction on your stencil aperatures? How much for what type of parts? We seem to have to many problems with resistor network aperatures clogging. How well does this paste release from small aperatures?
Electronics Forum | Fri Oct 28 10:26:39 EDT 2005 | james
Kester water soluble seems to work best for us at this point. I am just trying to figure out why we are having so many problems when we use AIM paste. It tends to stick to the blades, clog the aperatures and of course gives us insufficient solder.
Electronics Forum | Thu Dec 08 22:56:07 EST 2005 | davef
Questions are: * Is the stencil design proper to provide the correct amount of solder paste? * Is the stencil design proper to provide for release of solder paste? * Is solder paste filling the stencil aperatures, prior to separation? * Are stencil a
Electronics Forum | Sat Feb 19 09:26:19 EST 2005 | davef
Your customer asks a reasonable question. How do you know that your: * Paste has not dried? * Stencil aperatures have not become clogged? * On and on ... Some agrue that printing is the most critical process and that it drives all down-stream failu
Electronics Forum | Tue May 22 11:03:11 EDT 2007 | Michelle
We now have an AOI in our process after printing and have noticed that all the small aperatures are getting clogged by solder paste. Mainly on all fine pitch parts. We are using Kester ws R562 SN63/PB37 mesh -325+500 90% metal. It was manufactu
Electronics Forum | Thu Jan 08 16:16:09 EST 2004 | Dean
My first concern would be the choice of solder paste you have. There are better chemistries out there that far exceed the capabilities of the 609 2. Yes, the part will partially float on the solder (assuming plastic qfp). Cross sectioning would sho
Electronics Forum | Tue Sep 17 15:47:42 EDT 2002 | stepheno
Where I worked previously we had some boards with a couple 15 mil pitch parts. The first batch we got all had undersized pads. We had lots of bridging. We had less bridging with bigger pads. The ball size in the paste makes a bigger diffence regar
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