Electronics Forum | Sun Sep 02 07:55:19 EDT 2007 | lennielly
Hi every one I would like to have some inputs here,I would be very appreciated if you can give your suggestion; Currently we are working on 2 underfilled BGAs with SRT-1800 rework station(hot air type),one is mounted on a single sided PCB whereas the
Electronics Forum | Fri Jul 18 14:36:17 EDT 2008 | proy
I have a QFN which we are adding after process. (it was not available the day we ran the 4 prototypes.) We have removed most of the solder on all the pads, My plan was that a LITTLE solder on the center pad would wet and center the device (using a g
Electronics Forum | Mon Jan 17 21:14:19 EST 2011 | hegemon
Of the machines you have mentioned, the APE Bandit is your best bet. I had one of those in a previous employ and it was basically bulletproof, and simple enough to work on if things went wrong. Simple controllers and enough power to do the job at r
Electronics Forum | Thu Sep 15 19:12:27 EDT 2011 | smtmaxmary
WELCOME TO SMTmax Established in 2009, the Omxie Corp. is headquartered in California, with several offices worldwide. Our primary focus is in the development, manufacturing and marketing of SMT tools and equipment for prototyping and production. Ou
Electronics Forum | Mon Jun 17 19:10:04 EDT 2013 | hegemon
You have not mentioned exactly how the BGA was reflowed onto the board. Was it sent through the oven again after the mini-stencil, or was it heateed up and reflowed using a BGA rework station, or other hot air device?? From the sound of it (outside
Electronics Forum | Thu May 13 12:41:10 EDT 1999 | Eric
| | We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | | All other tips are also welcome. | | | | Thanks | | | Philip, | I have been doing
Electronics Forum | Sun Jan 10 08:44:32 EST 1999 | Dave F
| | | HI! I am a package engineer in Korea. I have some reasons | | | to desolder excessive solder at the lead of TSOP and TSOJ | | | after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. |
Electronics Forum | Mon Aug 04 11:34:45 EDT 2014 | spoiltforchoice
Well our small UK based company is I guess in a similar situation, there isn't the volume or value to justify an expensive solution for fiddly rework tasks. But it would certainly be nice to have one and may become more important in future as people
Electronics Forum | Tue Sep 28 04:16:18 EDT 1999 | Brian
| | | | | Jackie's posting recently and responses to it got me to dondering. First, recollecting, we bought an IR rework station a couple million years ago. It had a IR source on a stand, a bunch of lenses, and Reynolds aluminum foil for shielding
Electronics Forum | Mon Mar 08 20:17:41 EST 1999 | Michael Larsen
| | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | Concerning the BGA stuff, I'm getting about 60% success using
