Electronics Forum | Thu Jun 18 20:57:12 EDT 1998 | Dave F
BACKGROUND: We just got back from a neighborly visit at one of our board fabrication shops. I saw something interesting. Their HASL machine was just short of being field stripped. The story I caught was, the air pressure from knives change over
Electronics Forum | Fri Jun 12 14:22:53 EDT 1998 | Ryan Jennens
| Hey all! | The wave solder warrior is back. I have found a flux which leave almost no residue (the least yet), but because of its super low solids content I absolutely cannot get topside fillets. The multi-layer, two sided board is on a pall
Electronics Forum | Tue May 26 14:50:07 EDT 1998 | Dave F
| | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and sol
Electronics Forum | Thu Apr 16 14:09:04 EDT 1998 | Lou Madge
Dear Collegue, A seminar tittled "Things that you should know before selecting an alternative surface finish" will be offered on Friday, April 24 (during the week of the Nepcon East show) in Philadelphia. Topic that will be discussed include: Evalua
Electronics Forum | Thu Apr 16 14:07:49 EDT 1998 | Lou Madge
Dear Collegue, A seminar tittled "Things that you should know before selecting an alternative surface finish" will be offered on Friday, April 24 (during the week of the Nepcon East show) in Philadelphia. Topic that will be discussed include: Evalua
Electronics Forum | Wed Mar 11 10:58:58 EST 1998 | Earl Moon
| | What does the term "poor wetting" mean as a defect code ? "Poor" should mean unacceptable when surface (component or PCB solder termination areas) wetting does not provide acceptable solder joints. Unacceptable wetting of PCB solder termination
Electronics Forum | Mon Feb 23 23:42:11 EST 1998 | Mike
| Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. Depending on your rework station,Useing
Electronics Forum | Mon Mar 30 16:29:31 EST 1998 | Tony Arteaga
| | Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. | Depending on your rework station,| U
Electronics Forum | Tue Nov 27 15:37:15 EST 2001 | Dave G
I've seen some glass melf's fall off in our facility due to the glue not adhering to the body very well. You could pick these off with your finger after they had cured. (With little or no effort - I never bothered to actually measure the force requir
Electronics Forum | Fri Oct 05 11:59:54 EDT 2001 | mparker
I am looking to learn of possible causes and solutions for the following problem. A potential customer is demanding that I use a saponifier in the aqueous wash, he has lab test results of former CM's products that leads him to believe it is necessar
