Electronics Forum | Thu Sep 17 11:19:57 EDT 2009 | jdumont
Does anyone have a reference to a spec for this? We have a tall SMT IC that we coat with AR coating in a Asymtek spray coating machine. We do not have the angle head option to spray from a 45 so the sides of tall parts are sometimes left uncovered.
Electronics Forum | Mon Dec 10 13:56:51 EST 2001 | slthomas
1) The additional activity of the OA flux probably took care of the oxydation. How do you plan on taking care of the presence of conductive and corrosive residues from it now, though? You're not supposed to wash those parts with water. 2) The tomb
Electronics Forum | Tue Apr 02 22:58:10 EST 2002 | davef
Whatever I've said, my intent has never been to insult you. Smack you yes, insult you no. True, you never said the word �strings� but you did say � * �� shouldn't I be able to expect enough green strength from my epoxy to hold 0603 caps in place wi
Electronics Forum | Wed Jul 01 01:25:58 EDT 2020 | jmelson
> I think the main > issue is the bend radius you can apply to tape > with deeper pockets. Right, on my Philips CSM84, on the larger tapes, I don't thread the tape through the return slot, I let it play out the front of the feeder. The
Electronics Forum | Mon Jun 29 15:45:20 EDT 2020 | spoiltforchoice
Yeah my issue with the CLM945 type single slot feeders used for parts over 6mm is they index forwards using a tiny servo attached to some gears that pull on the cover tape. A system that begs to fail, the tape can stretch, the gears can start grabbin
Electronics Forum | Mon Dec 10 04:15:01 EST 2001 | Beny
Thanks for your advise Now I don't found Non-wetting defect at TIN COATED 0603 after I had increased peak temp and Time above 183 C. At film caps, I still found Non-wetting in high rate at film chip size 2416. I using PANASONIC's part with identif
Electronics Forum | Fri Dec 09 02:20:47 EST 2005 | Mike_Kennedy
Grant, I dont quite understand the implications my self yet on gold deposit using FLASH or ENIG. However the important part of the gold finish is that it is kept under 3% of the total solder joint, so normally its safe. With the FLASH process it is m
Electronics Forum | Tue Nov 15 16:57:22 EST 2005 | bk
If your problem is happening part way through the calibration the problem might be there is too much friction from your Y-wagon. Measure the friction on the Y-wagon using the service program if it fails or if it is near the max allowed try oiling up
Electronics Forum | Fri Jun 09 05:18:07 EDT 2006 | Rob
Hi Shawn, that you're baking the components makes me think that they are either old, or have been sitting around for a while (or none of the above & you are really dilligent!) Whilst baking will sort out the MSD issues (such as popcorning) it will
Electronics Forum | Thu Dec 14 10:14:04 EST 2000 | PeteB
Jacqueline, Asuming you mean immersion silver: Advantages - Very flat finish compared to HASL, more easily solderable than bare copper with OSP and more process tolerant than this in our experience, reasonable shelf life, cheaper than immersion gol
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