Electronics Forum | Mon Jan 22 16:41:21 EST 2007 | davef
Contact: * JC-14.1 Subcommittee on Reliability; Chair: Jack McCullen, Intel; jack.t.mccullen@intel.com 480-554-5354 * Rich Shook, Brian Vaccaro, and Brian Pottieger - Agere Systems [ http://www.agere.com ] * Francois Monette; Cogiscan Inc.; 450-534-2
Electronics Forum | Tue May 14 14:59:47 EDT 2002 | fmonette
Greg, As Dave pointed out, the main reason to bake components is to remove absorbed moisture from moisture-sensitive components. All you need to know on this subject, including the specific bake conditions (temperature and duration) are clearly s
Electronics Forum | Tue May 14 14:48:33 EDT 2002 | fmonette
Hi Dason, Here is some relevant information that you might find useful : J-STD-033, section 7.1.2.2 Dry Box : "Components may be placed in a dry box, capable of maintaining 25+/-5C and less than 10%RH. Nitrogen or dry air may be used." In other w
Electronics Forum | Tue Sep 03 18:14:35 EDT 2002 | fmonette
I have never heard about a requirement for temperature ramp-up for baking components at 125C. In general the concern for delamination with moisture sensitive components starts above 200C (peak body temp). Most important is you should bake your com
Electronics Forum | Mon Nov 03 12:15:12 EST 2003 | fmonette
Hi John, There are different types of cabinets available with desiccants or Nitrogen/dry air. The best choice depends on many factors in your production environment. The most important consideration for level 4 components, is to make sure that your
Electronics Forum | Tue Apr 27 10:05:36 EDT 2004 | Francois Monette
Hi CT, The bake requirements for Moisture Sensitive Components are defined in table 4-1 of the joint IPC/JEDEC J-STD-033A (link for free download at http://www.cogiscan.com, click on MSD Knowledge Base/Introduction). Normally you pick the highest
Electronics Forum | Thu May 06 13:19:57 EDT 2004 | fmonette
Hi Rob, You might want to consider changing your current procedure. Components classified MSL 4 have only a 72 hours floor life at 30C/60%RH. Even if you consider the de-rating factor (table 7-1 in J-STD-033A), at 50% this maximum exposure time wil
Electronics Forum | Mon Jan 10 16:14:17 EST 2005 | fmonette
Hi Gary, With plastic BGAs it is more difficult to remove the trapped moisture because of ground planes in the substrate. If your parts have been sitting around for a long time they may be soaked with moisture and in some cases the 48 hours bake cy
Electronics Forum | Tue Aug 26 08:59:27 EDT 2003 | fmonette
For more information on moisture-induced BGA warpage, I suggest you read the following paper that was recently presented at ECTC : "Impact of Ingressed Moisture and High Temperature Warpage Behavior on the Robust Assembly Capability for Large Body
Electronics Forum | Mon Aug 08 14:21:54 EDT 2005 | Mitch DeCaire
I know this is not the appropriate forum for commercial content, but I wish to clarify how RFID technology is deployed within Cogiscan's solution. The most common configuration involves the attachment of an RFID tag to each Feeder (not to each Reel)
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