Electronics Forum | Fri May 03 10:51:24 EDT 2002 | fmonette
Dave is correct. I am including additional information that comes from a recent posting on another industry forum : The proper guidelines for bag sealing are actually specified in the JEDEC standard EIA/JEP124 section 5.2.1 Packing moisture-sensiti
Electronics Forum | Mon May 13 10:37:56 EDT 2002 | fmonette
The other important issue relates to moisture sensitive devices (MSD). If you have MSDs on the first side, you need to track the remaining floor life of the components on the partially assembled boards between the first and second reflow. Contrary to
Electronics Forum | Tue Jun 10 11:07:33 EDT 2003 | fmonette
Another important element to consider is the impact of ambient temperature and humidity on Moisture Sensitive Components. The majority of plastic encapsulated ICs are classified as moisture-sensitive devices (MSD). This means that they are qualifie
Electronics Forum | Fri Aug 22 13:55:24 EDT 2008 | jdumont
We have used the Cogiscan system successfully here for 3 years or so now I think its been. I couldn't possibly imagine tracking MSL's on a lot of parts by hand... and being able to trust your numbers. This software will track everything for you and a
Electronics Forum | Tue Dec 02 02:11:39 EST 2008 | raranchado
We're using a PFC (Product Flow Controller) box by Cogiscan between a conveyor and Agilent SJ-5000 (AOI) and the problem we're having is that when the downline smema cable is connected to the PFC box, the AOI conveyor belt keeps on turning even with
Electronics Forum | Tue Dec 13 18:30:46 EST 2011 | IT23
Currently, we are using fixed barcode scanners that connect to Cogiscan PFC box. The scanners are mounted using a flexible arm. The flexible arm is hard to adjust so that the scanner will be on top of the label every time it hits the sensor. I'm look
Electronics Forum | Wed Oct 17 09:38:55 EDT 2001 | fmonette
Dear Daniel, I assume that these components are moisture-sensitive. If they have absorbed too much moisture prior to reflow you might be experiencing popcorning. This typically shows up as a bulge over the surface of the die, in the center of the p
Electronics Forum | Thu Feb 07 09:07:10 EST 2002 | fmonette
Dason, Please be aware that weight gain is only a very crude estimate of the component moisture content. This is only accurate when the moisture is uniformly distributed inside the component (which is actually never). This measurement is usually no
Electronics Forum | Wed Jul 17 11:45:48 EDT 2002 | fmonette
The current IPC/JEDEC standard J-STD-033 for moisture-sensitive devices does not include a bake cycle at 90C (it includes cycles at 40C and 125C for non-assembled components in reels or trays). However, the upcoming revision, which should be release
Electronics Forum | Mon Feb 04 12:30:25 EST 2002 | fmonette
Dave highlighted all the elements that must be considered to determine the optimal temperature and duration for a pre-rework PCBA bake process. As far as the component is concerned, it really depends if you care about not damaging the package for r
