Electronics Forum | Thu Apr 24 13:35:51 EDT 2003 | fmonette
Hi Jason, Welcome back to SMTnet. I just wanted to clarify one important detail relative to dry packing Moisture Sensitive Devices. Contrary to popular belief, it not necessary to use vacuum when sealing Moisure Barrier Bags. A simple heat seal w
Electronics Forum | Thu Sep 15 17:44:15 EDT 2022 | decaire
I agree with Evtimov that sticking with the J-Std-033 is preferable to creating your own procedure at a different temp, especially if you need to pass an audit since the auditors will compare your process to the J-Std. My understanding is that oxida
Electronics Forum | Mon Jun 16 17:13:24 EDT 2003 | fmonette
John, Maybe you know this already but I just wanted to highlight a few facts about dry cabinets. My experience is that many engineers are not well aware of the industry guidelines and sometimes will buy a dry cabinet without understanding the key f
Electronics Forum | Wed Nov 07 17:13:51 EST 2001 | fmonette
Hany, The guidelines for proper handling and storage of moisture sensitive components, like PBGAs are clearly documented in the joint IPC/JEDEC standard J-STD-033 (free download at http://www.jedec.org). In short you need to keep track of exposur
Electronics Forum | Wed May 15 13:11:26 EDT 2002 | fmonette
Hi Dason, Yes I was talking about the same paper. This is the best technical information available to clearly explain the physics of moisture diffusion inside a plastic package. Many of the guidelines contained in the current J-STD-033 are derived
Electronics Forum | Thu May 08 11:58:12 EDT 2003 | fmonette
Hi Chrissie, This might be old news to you but I just wanted to make sure that you are aware of all the implications of BGA rework relative to the control of moisture-sensitive components. For example, you need to keep track of the total exposure t
Electronics Forum | Sat Mar 24 12:31:31 EDT 2007 | diesel_1t
Hi there. Ok, i have a little big question for fuji Erudites: when machine run out of parts on any device it tells to machine "parts out (and part number)" So, a signal from anywhere (maybe a PLC output) will tell to the machine "hey i'm out of parts
Electronics Forum | Tue Jun 17 09:00:58 EDT 2003 | fmonette
Good question, here is the short answer : The problem is that dry storage is not the same as a bake process. If you want to bake saturated components, this should be done at higher temperatures. The IPC/JEDEC standard provides a table with bake temp
Electronics Forum | Wed Jul 03 11:37:36 EDT 2002 | fmonette
Dason, I apologize if some of the information sounds redundant but I don't think I explained my point very well (and the standard can get really confusing at times). I definitely agree with using C-SAM to look for internal defects. My only advise i
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