Electronics Forum: cogiscan inc (Page 1 of 4)

Baked Components

Electronics Forum | Fri Aug 16 10:10:49 EDT 2002 | davef

I think there are guidelines for baking in J-STD-033. Contact Francois Monette, Cogiscan Inc., 450-534-2644, fmonette@cogiscan.com With the 125�C for 12 hours, er whatever, bake you are trying to strike a balance between: * Removing the moisture f

Moisture Sensitivity for Integrated Circuits

Electronics Forum | Wed Mar 19 10:28:03 EST 2003 | davef

Contact: Francois Monettet Cogiscan Inc. Work: 450-534-2644 E-Mail: fmonette@cogiscan.com

Moisture Sensitivity for Integrated Circuits

Electronics Forum | Thu Mar 20 15:12:01 EST 2003 | fmonette

Hi Carol, You can find many complete articles on the subject of MSD Control in the MSD Knowledge Base on our web site at http://www.cogiscan.com Do not hesitate to contact me directly if you have specific questions. My company is an active member

Bar code Scaning system

Electronics Forum | Thu Jan 13 16:15:05 EST 2005 | fmonette

Hi Steve, My company offers this kind of system in two different versions ; a low-cost semi-automatic configuration using barcode labels and a closed-loop configuration using RFID tags to retrofit existing feeders into smart feeders. Please contac

double side reflow soldering

Electronics Forum | Thu May 16 11:37:13 EDT 2002 | fmonette

My company offers a simple and cost effective control system for MSDs on the factory floor. It is a turnkey solution to comply with J-STD-033. If you want more information feel free to contact me offline. Francois Monette Cogiscan Inc. Tel : 450-53

Moisture Sensitivity Level 2 Component Baking

Electronics Forum | Tue Jun 29 14:33:49 EDT 2004 | fmonette

This is an active item of discussion for the upcoming revision of J-STD-033. Most likely the bake table 4-1 will be modified to include guidelines for level 2 components. Francois Monette Cogiscan Inc.

PCB bake-out after cleaning

Electronics Forum | Wed Dec 17 14:38:25 EST 2003 | davef

Francois Monette [Cogiscan Inc. 450-534-2644 fmonette@cogiscan.com ] is the resident genius on component and board baking. If he doesn't chime-in a in a day or so, give him a shout. He seems to nap quite a bit. Alternately, if you search on his na

Baking Moisture Sensitive Components >4.5mm

Electronics Forum | Mon Jan 22 16:41:21 EST 2007 | davef

Contact: * JC-14.1 Subcommittee on Reliability; Chair: Jack McCullen, Intel; jack.t.mccullen@intel.com 480-554-5354 * Rich Shook, Brian Vaccaro, and Brian Pottieger - Agere Systems [ http://www.agere.com ] * Francois Monette; Cogiscan Inc.; 450-534-2

BGA bake out....

Electronics Forum | Mon Jun 28 10:02:06 EDT 2004 | fmonette

The answer is yes, it is possibly a moisture-related problem. You can confirm this by baking your parts at 125C for 48 hours (ref. J-STD-033A, table 4-1). For more technical background on this issue I recommend you read the following paper : Impac

What does MSL 4 on a component package means?

Electronics Forum | Fri Jan 04 15:34:49 EST 2002 | fmonette

As Dave mentioned we have put together a MSD audit checklist to insure that your internal procedure is complete and in line with J-STD-033. It's a free download at http://www.cogiscan.com, click on Moisture Sensitive Devices to access the MSD Knowle

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