Electronics Forum | Tue Jan 10 12:17:17 EST 2006 | Rob
Hi, The ROHS compliant parts are usually Matte Tin on the outer terminal plating. There are also 2 further types of metal on the average chip cap - the undercoat metal of the outer electrode & the inner electrode. These are usually the same & are
Electronics Forum | Mon Jan 29 09:50:37 EST 2007 | rgduval
I'm about to begin a job for a customer placing a couple of lead free BGA's/FPGA's on an assembly that doesn't need to be RoHS compatible. So...my question is...should I process this assembly with lead-free solder paste, to accomodate the lead-free
Electronics Forum | Thu Sep 11 20:32:08 EDT 2008 | diesel_1t
I know that most of the problems are called solder issues, this is why i put "solder related" quoted because i have seen more than usual "solderability issues" posted on this forum lately. I had a tombstoning issues with 0603 resistors, on some mat
Electronics Forum | Mon May 15 05:17:18 EDT 2006 | Rob
Hi Patrick, Sorry, wrote it in a hurry on Friday afternoon, I meant show us evidence of a scientific trial on all or at least some other alloys. I accept Tin whiskers and other similar phenomina exist, I even accept that the whole ROHS directive
Electronics Forum | Thu Apr 19 08:50:38 EDT 2007 | rgduval
Welcome to RoHS. Or, at least, to the version of RoHS that I've had to deal with since I started with my current company. Blowholes and pinholes seem to be common in PB-free manufacturing. At least, they have for me here. I also note that IPC has
Electronics Forum | Tue Jul 20 12:49:38 EDT 2004 | mmjm_1099
We are having a problem with our Heller 1800W oven with certian parts skewing. It seems that some inductors and taller Can caps are shifting around in the oven. It seems it will solder fine and than all of a sudden just be off to one side or the othe
Electronics Forum | Mon Nov 09 07:21:02 EST 2009 | CL
Good Morning, I have seen many posts regarding BGA voiding being excessive and what can be done to better the condition. I have a customer that has an assembly that we have had a diufficult time with. We have spent a lot of time debugging the proces
Electronics Forum | Sat Oct 18 09:30:43 EDT 2008 | hussman
Sounds like a part problem. You can SOMETIMES over come this with a hotter profile. We see this a lot with brokered parts. Seems like a lot of people are rejecting parts because a lot of companies haven't perfected their RoHS process, yet produce
Electronics Forum | Sat Jun 02 08:47:25 EDT 2007 | mika
I almost forgot; If the pcb have HASL (Non RoHS) surface finish, then big fine pitch QFP:s could be shifted during reflow, beacuse of the un-even pad-surface... We have been trough that scenario also... But step No.1 is to make sure that the componen
Electronics Forum | Thu Oct 21 02:31:27 EDT 2010 | rok
OGER 4003C bounding to Aluminum I am hoping someone might have the solution to my problem I have the following PCB: RO4003 Thickness: .2mm Layer: top single/ bottom ground plane Finish: silver top and bottom .2um Size: 3mmx6mm I need to bound/groun
