Electronics Forum | Mon Feb 12 10:02:18 EST 2007 | rgduval
A little late to the party here, sorry... Has the joint been verified as a cold solder joint? That is, visually confirmed that it looks like cold solder, and, perhaps, xrayed to confirm the solder status? X-raying may sound a bit extreme, but you'
Electronics Forum | Thu Dec 04 10:59:02 EST 2014 | rrosera
HI, I work for a company in New England and recently had a unusually large number of boards fail after replacing a BGA on them. We use a AirVac DRS25 to remove and replace the BGA witch uses local forced hot air. We usually have at least a 90% s
Electronics Forum | Sun Jan 14 16:35:48 EST 2007 | Austin
I have several boards built at various CM's. We have prototype builds with some JTAG failures on BGA's (1-3 failures with qty 3, 1500 pin BGA's). CM's always claim reflow profiles look good. X-ray does not show bridges and they claim it looks good, b
Electronics Forum | Wed Aug 04 20:06:24 EDT 2004 | C.W
Customer returned a brd claim that one of the FPGA is having "cold solder joint". I inspected the the BGA location with X-ray and Ersascope, balls' shape look fine, voids are not detected, perimeter joints show shinny and smooth appearance, i have se
Electronics Forum | Tue Mar 20 05:26:32 EDT 2007 | CL
Hi Chrissie, BGA Rework from one CM's view: 10% process problem (printing, reflow, voids, etc) 10% component failure (no other problem found) 80% "The board does not work therefore it must be the BGA" This, of course, is exaggerated. My point bein
Electronics Forum | Wed Dec 04 18:10:07 EST 2019 | thunder
No they weren't added, never been serviced. The top legs don't have that hard wire exposed,just the bottom 2. It seems when the connection broke {bad solder failed from TV being turned on and off going from heat to cold ?} them jumper wires appear
Electronics Forum | Thu Mar 31 06:09:19 EST 2005 | amstech
Yes, components do contribute to the non wets in fine pitch reflow. Oxidation is the main culprit. May ask where it is coming from. Can not say in particular. May be burn in test process or end of line baking, hot / cold testing and need to run DOE'
Electronics Forum | Thu Apr 05 09:17:40 EDT 2007 | itaig1
I have seen a method used where the pins on the connector are of the same materials as the thermocouple and the connector is connected via single strand wires of the same material to the PCB however the wires were spot welded to bare copper pads to r
Electronics Forum | Wed Apr 21 20:50:26 EDT 1999 | Dave F
| I'm having problems with trying to get a good solder joint using a Ceramic PCB. We are using AMTECH hi-temp solder (ws-486 96.5/3.5ag). My profile looks great and I used the recommended profile from Amtech with a few adjustments. My max temp is abo
Electronics Forum | Mon May 22 16:50:50 EDT 2000 | Kathy Palumbo
Mike, Is that greater than 80% yeilds, or less than? Here are the answers to your questions: Is you placement guranteed good? YES What x-ray have you used? Nicolet Are your fab.'s known good? YES Could you de-solder Samsung and replace with ano
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