Electronics Forum: cold form (Page 1 of 2)

Re: Multilayer PTFE Boards

Electronics Forum | Mon Dec 18 22:36:37 EST 2000 | Charles Harper

The major problems are poor layer to layer bond strength(due to surface tension of most fluoropolymers),and poor cold flow,or dimensional creep of these materials.Please also click on Chapter Author Konsowski,listed above.E-mail form will pop up when

Solder sticking to Stainless Steel Fasteners

Electronics Forum | Thu Oct 20 05:58:19 EDT 2005 | Slaine

Hi could be relaited to the thermal mass of the screw/bolt. if there is no intermatalic formed and the solder just picks off id say this is likely. the hot wave hits the cold screw and cools the solder enought to leave some behind??

What pressure is recommended to clean AMT boards after reflow

Electronics Forum | Sat Sep 08 09:36:26 EDT 2001 | davef

good : Imported/Hoegaarden Original => very good]. Finish mowing the lawn, plop-down in a chair on the back porch, fumigate the neighborhood with an A Feunte, and smile about having a cold wheat beer in hand with those little rivlets of condensed mo

OT: Wavesolder Process Engineer Needed

Electronics Forum | Fri Jul 25 15:06:04 EDT 2008 | wavemasterlarry

Art is something you hang on the walls. Science is what makes rockets go up. Soldering is just soldering. It's technical. Kinda like saying your doctor is a surgen. They're not the same people but some of the things they do looks the same, yet t

Aluminum Capacitor disassociated from sodler joint

Electronics Forum | Fri Feb 15 15:37:35 EST 2019 | emeto

Hello, I have a capacitor that doesn't form intermetallic joint with SAC 305 solder paste.The board is ENIG. Solder melts and forms good intermetallic joint with the PCB finish. However, capacitor can be removed with physical force - it looks like a

Component testing

Electronics Forum | Thu May 22 00:21:27 EDT 2003 | AlCapone

The alternative is by looking at all your components data specs (heat-range), especially pay more attentions to heat-sensitive comps, and fine-pitch comps, odd-form comps, draw a diagram on a separate sheet of paper shown that temperature VS those ca

Re: Adhesion of conformal coating to plastic components

Electronics Forum | Tue Jun 02 17:36:43 EDT 1998 | Chris Fontaine

| | We have experienced poor adhesion of acrylic conformal coating to plastic bodied IC�s. The observed symptoms of this are a blistering or lifting of the coating at the surface of the component, although peel testing has revealed that this is not

Re: Adhesion of conformal coating to plastic components

Electronics Forum | Tue Jun 02 18:01:47 EDT 1998 | Earl Moon

| | | We have experienced poor adhesion of acrylic conformal coating to plastic bodied IC�s. The observed symptoms of this are a blistering or lifting of the coating at the surface of the component, although peel testing has revealed that this is no

HASL vs. ENIG

Electronics Forum | Thu Dec 14 12:18:01 EST 2000 | genny

Hello all, Our company has always used HASL finish on our products. Recently however, we have a had a problem on a couple of boards that I have been told cannot be avoided with HASL, and we should switch to ENIG(electroless nickel immersion gold).

Re: Adhesion of conformal coating to plastic components

Electronics Forum | Tue Jun 02 15:53:32 EDT 1998 | Earl Moon

| We have experienced poor adhesion of acrylic conformal coating to plastic bodied IC�s. The observed symptoms of this are a blistering or lifting of the coating at the surface of the component, although peel testing has revealed that this is not al

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