Electronics Forum | Thu Sep 19 21:46:01 EDT 2002 | scottefiske
In the past year I was responsible for developing and leading a Team focused on AOI, Evaluation, Justification, and with a full ROI required, supporting a HMLV manufacturing environment. If you have in these economic times the additional resources t
Electronics Forum | Thu Dec 21 15:13:16 EST 2017 | georgetruitt
Is the process the same for every product running through the selective solder machine? Load program, acquire or set up fixture, Change/load flux?, Change/Load solder pot? Are the machines cold when the operators need to use them or are the machin
Electronics Forum | Wed Aug 04 20:06:24 EDT 2004 | C.W
Customer returned a brd claim that one of the FPGA is having "cold solder joint". I inspected the the BGA location with X-ray and Ersascope, balls' shape look fine, voids are not detected, perimeter joints show shinny and smooth appearance, i have se
Electronics Forum | Mon Apr 24 15:11:11 EDT 2006 | pjc
For solder joint inspection you cannot beat AXI. That's what is was designed for. AOI machines were designed for component inspections and solder joint checking was an add-on. In transmission AXI you can get a measurement of the whole solder joint. A
Electronics Forum | Fri Apr 21 18:43:23 EDT 2006 | SD
Sorry, I have not read the article. However, I do have five years experience constantly tweaking an AOI system that ran ONE product! The strength of the machine was solder inspection. The biggest problem was component color variation and shadowing
Electronics Forum | Wed Apr 19 04:38:49 EDT 2006 | ge_lim
Hi Refering to the Apr edition of SMT , page 24 to 29, anyone got experience on implementing the AOI or 3D x ray : a) What is the pros and cons? b) What is the trend in the PCBA industry for wave soldering inspection? c) Will this implementation co
Electronics Forum | Wed Aug 30 07:34:23 EDT 2006 | Xray Tester
For Automated x-ray inpsection system comes in 2D and 3D. 2D also know as the transmission xray inspection where xray are generated from a fixed point source. On double side board, this does not work that well. That where 3D Automated x-ray inpsectio
Electronics Forum | Mon Jun 18 16:48:00 EDT 2001 | Gil Zweig
We have found a significant number of PBGA problems associated with physical deformation of the package. Deformations such as dishing (potatoe chipping) and delamination under the die (popcorning). These can be detected by x-ray by the variation patt
Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs
Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t
Electronics Forum | Thu Jun 08 01:46:00 EDT 2023 | camilleyang3
To prevent BGA (Ball Grid Array) issues related to SMT (Surface Mount Technology) solder resist when fabricating a PCBA (Printed Circuit Board Assembly), you can follow these guidelines: Design considerations: Ensure proper spacing between BGA pads
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