Electronics Forum | Fri Jul 09 11:19:58 EDT 1999 | Carol Brumfield
Has anybody successfully used an automated dispensing system to put solder paste dots on .5 mm pitch pads?? I need to replace some Meritec tsop sockets and I don't want to use the single site stencils for .5 mm parts.
Electronics Forum | Sat Jul 10 12:18:10 EDT 1999 | Steve
| Has anybody successfully used an automated dispensing system to put solder paste dots on .5 mm pitch pads?? I need to replace some Meritec tsop sockets and I don't want to use the single site stencils for .5 mm parts. | Try http://www.winslowaut
Electronics Forum | Fri Jul 09 11:28:24 EDT 1999 | Earl Moon
| Has anybody successfully used an automated dispensing system to put solder paste dots on .5 mm pitch pads?? I need to replace some Meritec tsop sockets and I don't want to use the single site stencils for .5 mm parts. | Carol, Don't blame you f
Electronics Forum | Wed Mar 21 11:42:54 EDT 2012 | davef
Downhole solder suggestions, in order of preference are: * Kester Sn96.3Ag3.7. Most vendors do not stock straight tin-silver alloys, whose wallet is that fat? * SAC305 can usually be used in place of one of the copper-free tin-silver alloys in downho
Electronics Forum | Tue Sep 25 12:50:13 EDT 2001 | mparker
Since you are mostly concerned about the flux and suspect an application issue, you need to do a few things to validate whats going on. 1. Forget about speed of processing, length of time to do the job. Focus on accuracy first, then speed. with that
Electronics Forum | Thu Mar 03 14:01:16 EST 2022 | chris007
Hello Baking before solder pasting and reflow actually due to poential moisture development. This is JDEC requirement I believe to do so. We AOI after cleaning so we AOI a clean PCBA
Electronics Forum | Wed Nov 01 07:32:33 EST 2006 | davef
What you have run up against is the unfortunate consequence of the transition period from Sn-Pb to Pb-free. In the past 2-3 years there have been several studies highlighting the differences in reliability between mixed metal systems, Sn/Pb, and SAC
Electronics Forum | Wed Nov 08 19:49:41 EST 2006 | davef
Dr. Brian Toleno wrote that section of the posting that I pasted onto the forum. Try: * �Lead-free Soldering Backward Compatibility�, Pan, et al., IPC/JEDEC Pb-free Conference, San Jose, 2006 * Checking with http://www.ipc.org * Contacting Jianbia
Electronics Forum | Mon Sep 18 12:04:43 EDT 2000 | Erick Russell
Photonic Soldering is useful for several applications in rework where current methods using hot air are inadequate or inefficient. For high-density assemblies, component clearances are limited. In the past, DFM (Design for Manufacturing) specificati
Electronics Forum | Thu Sep 27 15:16:34 EDT 2007 | novaman
Hi everybody, I did post in the past last year and I always got good answers. If I'm going to solder something with Tin-Lead solder and then put it outside (it will be exposed to water, sun, cold nights,...), how long does it take starting to rust?
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