Electronics Forum | Thu Sep 07 10:03:30 EDT 2000 | KS Wong
Hello, I am looking for input on the 7 zone convectional reflow oven on the temperature profiling. I having a problem with the flux/solder spattering on the Au cotact fingers. I have ran some experiment with the soak time and reflow time. Anyway,
Electronics Forum | Thu Sep 07 11:02:29 EDT 2000 | Travis Slaughter
Maybe its not splatter, in my experience a sloppy operator can get paste on contacts and just one sphere can rune them and can look like splatter.
Electronics Forum | Fri Sep 08 00:24:35 EDT 2000 | Jim Arnold
Sudden flux boil will cause splatter. More thorough drying or a slower intial ramp to allow drying to occur before a boil or "splatter" temperature is reached may aid your problem.
Electronics Forum | Fri Sep 08 04:45:17 EDT 2000 | PeterB
As per Travis's reply it could be something other than the reflow process. Another good one is if the printed PCB's have been cleaned down due to print misregistration etc.. If not properly controlled paste residues can remain distributed about the p
Electronics Forum | Tue May 30 13:50:40 EDT 2006 | Dragan
Hi, I ran into a problem and need a solution. It is a 3cm*4cm*1mm 2 layer PCB (6x6 panel) with a LQFP128 package Microcontroller, a resonator and 2 capacitors. What happens is: When i recieve the assembled pcbs from the assembly plant they wor
Electronics Forum | Tue May 30 17:17:08 EDT 2006 | Dragan
Hi, I ran into a problem and need a solution. It is a 3cm*4cm*1mm 2 layer PCB (6x6 panel) with a LQFP128 package Microcontroller, a resonator and 2 capacitors. What happens is: When i recieve the assembled pcbs from the assembly plant they wor
Electronics Forum | Wed Oct 26 23:29:57 EDT 2005 | milroyperera
Hi, As I have seen in the data sheets from solder paste suppliers they always recommend to keep the solder paste until it reaches the ambient temperature after taking out from normal storage temperature. Mostly the storage temperature is 5 - 10 Cels
Electronics Forum | Thu Apr 22 08:43:25 EDT 1999 | Michael N.
| | I'm having problems with trying to get a good solder joint using a Ceramic PCB. We are using AMTECH hi-temp solder (ws-486 96.5/3.5ag). My profile looks great and I used the recommended profile from Amtech with a few adjustments. My max temp is a
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Electronics Forum | Fri May 29 08:25:13 EDT 2009 | floydf
We are getting what looks like cold solder joints on one of our boards. The boards have an aluminum substrate, and use OSP plating. The solder is lead free - 96.5 Sn, 3.0 Ag, .5 Cu. The flux is no clean. When we first had the problem, my solder profi
