Electronics Forum | Mon Nov 21 17:55:19 EST 2005 | slthomas
"...Moonman is a pretentious wannabe in the industry. If you look through the archives here you'll see that nothing could be further from the truth. His contributions on the past were pretty friggin' spot on. However, he no longer posts anything t
Electronics Forum | Fri Jan 12 00:59:04 EST 2007 | Guest
Your evaluation results confirms that Real Chunks is right on thermal mass absorption of the shield, that probably brought cold spots during reflow . I agree with his suggesttions as well.
Electronics Forum | Tue Jan 16 03:05:32 EST 2007 | aj
All, The component that seems to be effected most is a : NemeriX NJ1006A QFN type device. If heat isthe problem what exactly is happening to the part -cold spots? joints not soldered? aj...
Electronics Forum | Wed Feb 21 15:29:34 EST 2007 | wavemasterlarry
I here alot of guys at my place talking about cold spots in the oven. You may want to check for them in yours.
Electronics Forum | Mon Nov 04 07:27:33 EST 2019 | amitthepcbguy
There are multiple methods where you can perform top and bottom reflow soldering simultaneously. With this method, you might not worry about the type of flux there is. Each part is covered and baked as per the requirement, while making sure there are
Electronics Forum | Thu Jun 10 20:39:02 EDT 2010 | ada
T962's have a great reputation for cold spots, non-RoHS capable, and catching on fire. however, one can't argue that they are quite inexpensive! The T200's can be had for ~$2k and are apparently not too bad. See this thread for some first hand accou
Electronics Forum | Thu Sep 16 01:54:46 EDT 2010 | sachu_70
Hi Gani, Immersion Ag finish has lesser shelf life as it can get more easily oxidized on exposure. However, I see concern in your Reflow profile. A few questions: Have you compared your reflow profile to the solder paste manufacturer's recommended pr
Electronics Forum | Mon Mar 02 00:38:35 EST 2009 | sachu_70
Hi Jorge, The success of such production purely depends on process control. One needs to first understand the board layout in detail, and evaluate any critical components for their temperature handling capabilities. Remember, you are dealing with com
Electronics Forum | Tue Oct 10 07:30:19 EDT 2017 | spoiltforchoice
TBH I think perhaps the OP deserved it, there is perfectly good explanation of Reflow and Process Window Index on Wikipedia for starters and if you want more all sorts of FREE specialist papers on things like reflowing flex circuit, lead/lead free et
Electronics Forum | Sat Nov 15 05:08:45 EST 2014 | grimus
Same side (component side) if You give me e-mail I can provide You more pictures. I'm making one stroke with same speed (I'm using closed proflow head and DEK printer). 5 mils thickness stencil. Products requirement - 3 IPC Class (75 % and more fill
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