Electronics Forum | Fri Aug 22 03:19:08 EDT 2008 | andrzej
Hi, what do you mean by collapsed ? Can you describe or send a photo ?
Electronics Forum | Mon Jul 12 09:13:08 EDT 1999 | Mark Charlton
I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-layer
Electronics Forum | Thu Nov 19 07:53:08 EST 2009 | edmaya33
Check your profile, it might not have collapsed completely.
Electronics Forum | Wed Jan 17 20:33:19 EST 2001 | davef
The corner balls are supposed to collapse, but at roughly the same time as the other balls collapse. Also, those balls are located in the place that isthe easiest to get hot. Think about cranking-up the bottom heat, waiting, and slowing down the pr
Electronics Forum | Wed Dec 01 21:40:06 EST 2004 | Grant
Hi, High temp solder balls don't collapse in current lead based soldering, so lead free balls are similar, and don't collapse, but should still solder ok. They just look different. However I would like to know other peoples experience about reliabil
Electronics Forum | Fri Aug 22 00:20:29 EDT 2008 | rameshr
Hai, In our process we are using the micro bga of size 13X13mm of pitch 0.45mm,after soldering process the bga found collapsed, we absorbed that the PCB land pattern of the BGA was not in array, uneven distribution of pads (area) & most of the pads
Electronics Forum | Tue Aug 25 07:13:20 EDT 2009 | davef
It sounds like the BGA balls are not melting. You're probably getting no collapse. Put a bare BGA on a hot plate. Heat it up until you get collapse. Adjust your reflow profile until you have that temperature on the BGA pads on the board. What is the
Electronics Forum | Mon Jul 12 12:28:10 EDT 1999 | Wolfgang Busko
| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye
Electronics Forum | Mon Jul 12 12:39:39 EDT 1999 | M Cox
| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye
Electronics Forum | Wed Jul 14 14:05:52 EDT 1999 | KT
| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye
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