Electronics Forum: common msl components (Page 1 of 47)

Most common BGA types

Electronics Forum | Tue Oct 01 18:32:55 EDT 2002 | davef

We don't like ministencils. Consider using the patterns listed in the Practical Components and Topline catalogs. Few BGA we see have a 3X3 courtyard.

smt common pad 0402 and 1206 package

Electronics Forum | Fri May 06 08:47:05 EDT 2016 | davef

You're correct. This design will have a record amount of 0402 rework for tombstoning and misalignments. Suggest that the pads on each end of all components be the same size in order to balance wetting forces during reflow.

Renco Power inductor (RL-1608-S-330) - common failures??

Electronics Forum | Wed Jun 09 14:41:12 EDT 2010 | ronchap200027

Has anyone had issues with Renco inductors failing. The component I'm having problems with is a 330uH shielded power inductor. Out of 36 board failures, I have 17 that failed because this inductor failed. Most often they end up reading -1.34 uH.

Skewed components

Electronics Forum | Wed Apr 25 07:57:36 EDT 2001 | wbu

Steve: Try to find something that�s common to all your skewed parts. We haven�t had much trouble with it except for some MELF diodes a couple of years ago which didn�t look well aligned but made no trouble with specs. Better suited pad design solved

Skewed components

Electronics Forum | Tue Apr 24 21:12:32 EDT 2001 | davef

I prefer mine skewered with a remoulade, yum. IPC-A-610 allows component side overhang to the lesser of either up to 25% of the component termination width or up to 25% of the width of the pad for Class 3 devices. Help us understand your problem.

assembly with/without TH components

Electronics Forum | Thu Jan 11 07:16:12 EST 2018 | stephendo

You might want to look at pin in paste. It is not very common but I have seen it work very well.

LInk for the components

Electronics Forum | Sun Mar 21 04:44:28 EST 2004 | Laxmanan

We are recieving BOM from our customers.Certain customer's BOM will not specify the complete details in the description Column (Like Package,tolerace, voltage limits etc).They will be specifying the MFR's PArt # only. Is there any common website avai

V-score cracking components

Electronics Forum | Tue Oct 25 22:28:27 EDT 2005 | KEN

I have never heard of heating boards prior to v-score. Have you established any trends on component orientation and cracking? What is your v-score thickness range? Do you have your blades regularly sharpened? Have you measured your blade alignment?

Moisture sensitive components (MSC)

Electronics Forum | Tue Feb 20 15:39:31 EST 2001 | fmonette

To my knowledge, the 40C was established as the maximum "safe temperature" for all tape and reel packaging. The actual specs may vary somewhat for different types of reel, pocket-tape, cover-tape but you must be concerned with the cover tape adhesive

assembly with/without TH components

Electronics Forum | Wed Jan 10 04:33:05 EST 2018 | spoiltforchoice

Simulating with what? In developed countries manual labour is expensive but is also still the most common solution to fitting though hole parts, even if the board are then wave-soldered. Mixing SMT and THT on what sounds like a very simple product wi

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