Electronics Forum: component[0] (Page 1 of 1)

Assembleon / Philips

Electronics Forum | Wed Feb 24 04:22:38 EST 2016 | dzadza

Hi, I'm trying to use the PCB SYNERGY software, when I press the process button the following message appears. PADS ASCII 2005 file in development!... NoSMTComponents = 0 NoComponents = 0 NoSMTFeeders = 0 NoFeeders = 0 This file is suitable for SM

DEK 265GS

Electronics Forum | Wed Feb 09 09:59:25 EST 2005 | aj

Randy, We have a Dek 265GSX and 265 MK1. We print 20thou pitch components, 0.5mm. Just make sure you have good board support and USC. aj

Fuji CP6 and IP3 specifications request

Electronics Forum | Fri Aug 05 08:15:39 EDT 2016 | jdengler

The IP3 specs are: PCB Dimensions Max: 508 mm x 457 mm - Min: 80mm x 50mm Thickness: 0.8 to 4.0mm Component Capacity Tape: 74 - 8/12mm Device Locations Tray: 40 Locations Placing Rate: 0.55 sec/component for small chips 1.25 sec/component for ICs

Yamaha Machine

Electronics Forum | Wed Sep 06 06:04:16 EDT 2000 | Dreamsniper

Hi Guys, I'd like to collect info regarding YAMAHA YV88 Mark2 and YV100 series. Are they of any good compare to Universal GSM1 or Panasert MPAV2 ? My new company's products have hips of fine pitch components (0.5mm) and we are planning to get new eq

fine pitch on thick copper

Electronics Forum | Mon Dec 20 07:58:02 EST 1999 | pascal MATHIEU

hello guys ; we are using a fine pitch component(0.65mm) on a thick copper PCB (Cu = 90�m) ; in this case we notice that we are in the process'limits , because the different supplier of the PCB are not able to ensure a good stability of it's process

Odd problem on GSM2 running USOS 4.52

Electronics Forum | Sat Apr 01 16:41:01 EDT 2023 | dilogic

Today I stumbled upon very odd issue - we have one GSM2 with FlehJet heads on both axes. New program was created and it stops on the first task for Head2 throwing out a message like this: "Component 0u1/0805 (reference id C4) can't be found wit

Step-up stencil: recommendation thickness

Electronics Forum | Mon May 20 12:01:37 EDT 2019 | gregoireg

I have a PCBA job which has on the top side a few standard QFN components (0.4mm pitch) and a big module (35mmx60mm) with 1.13mm BGA pads: https://imgur.com/a/YUGgejW To be clear, this module is composed of a PCB with some components on top and some

Yamaha/Philips Model Number Cross References

Electronics Forum | Thu Jul 07 19:39:18 EDT 2005 | darby

This is a very difficult question to answer as it will depend greatly on your component mix. I will presume that the CSM 84VZ is of the following configuration: 2 x RDC Synchro Heads. Heads 1 & 2. These are mechanically centering heads with a chucki

Re: DFM / DFT information

Electronics Forum | Thu Jul 13 22:20:38 EDT 2000 | Dave F

=10 mils larger than lead 3 silk screen legend text weight >=10 mils 4 pads >=15 mils larger than finished hole sizes 5 place through hole components on 50 mil grid 6 no silk screen legend text over vias (if vias not solder masked) or holes 7 so

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