Electronics Forum | Wed Dec 18 20:08:36 EST 2002 | jonfox
Are your components not in JEDEC trays? We use Kostat trays and we can bake our parts at or up to 150C. What are your temperature requirements, and what are your parts currently being stored in or on? There are a slew of tray makers out there that
Electronics Forum | Wed Feb 16 17:28:14 EST 2005 | davef
Greg: As we understand it, in your situation: * One 0805 lead solders to board properly * Another 0805 lead does not solder On the 0805 lead does not solder, there does the solder go? * On the pad * On the component lead A common solderability test
Electronics Forum | Wed Jun 21 13:06:02 EDT 2006 | grantp
Hi, If your worried about them being lead free components, because it's "not clear" then you should be able to ask the manufacture of them if they are lead free, as they normally trace the batch code, and manif date and will know for sure. Most pas
Electronics Forum | Mon Aug 31 08:45:37 EDT 2020 | colsenfoto
I am in the process of making a requirements-document for manufacturing of a PCB. I would like to state some requirements for maximum allowable component shifting in the final PCB (both displacement and rotation). However, I can't find any (IPC) sta
Electronics Forum | Fri Sep 18 12:21:03 EDT 2009 | kennyg
Does anyone have any off-the-shelf tool for measuring air gaps under components? Specifically to measure if a part is raised beyond special specifications, such as determining if a leaded connector is raised beyond 5, 10 or 20 mils from the PCB surf
Electronics Forum | Wed May 17 03:00:45 EDT 2000 | Avichai Ramot
I have shifts in the placement of qfp240 components. I have this problem with al my IC machines: Fuji-Ip2,Ip3 ,siemens F-4.
Electronics Forum | Thu Nov 11 19:23:33 EST 1999 | Dave F
Gary: Sounds like the spacing between each pad for the component are too far apart. My 2�. Dave F
Electronics Forum | Tue Mar 09 12:57:43 EST 1999 | Jan Pasternak
I want to identify a pre-production prototype test house to evaluate new parts in the Chicagoland area. Capability of running high speed pick and place and soldering components to test board.We will submit boards and parts.
Electronics Forum | Tue Jan 13 10:53:05 EST 1998 | Tonya Warner
It is also my job to ID and cross components. I have found that the same number can be used by different manufacturers for different parts, same package style. There is not a standard marking system for SMT devices so watch out for this.
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