Electronics Forum | Thu Jun 25 05:19:39 EDT 2020 | SMTA-Davandran
Dear all, Anyone know what is minimum gap between SMT component.? Anyone have design guideline for it.
Electronics Forum | Thu Dec 07 14:28:25 EST 2006 | russ
Bad design if you have to have a perfect 1206 part. you will always have a lift of some sort when reflow soldering. Solder is 3 dimensional, therefore you cannot get any underneath component, thus eliminating the automated SMT process. Cannot glue
Electronics Forum | Fri Dec 08 16:54:42 EST 2006 | flipit
My experience with SMT LED packages is that certain LED package styles tend to float. This floating is caused because the LED is often only terminated on the bottom side of the LED package. Sometimes the LEDs are terminated like a SMT resistor with
Electronics Forum | Mon Jul 18 12:24:53 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Mon Jul 18 12:25:30 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Wed Sep 02 15:02:36 EDT 2020 | SMTA-64387501
We have recently received some pre-tinned "flat lead packages" and the question I have relates to the definition of solder touching the component body of the part. Typically when I have gold lead parts tinned there is a gold gap between the tinned po
Electronics Forum | Thu Sep 03 22:03:32 EDT 2020 | SMTA-64386139
Both conditions are acceptable for this bottom brazed flat pack package. The solder coverage must be within 0.070 inch of the lead/package interface per MIL-PRF-38535, paragraph A3.5.6.3.4.a. While that requirement could allow for a gold gap near t
Electronics Forum | Tue Jan 31 13:20:15 EST 2006 | mgdrouin1
Does anyone have any information regarding damaged caused to components due to overheating primarily with a heatgun? I'm having a hard time getting engineering to comply. Thanks
Electronics Forum | Tue Jan 31 13:22:15 EST 2006 | mgdrouin1
Does anyone have any information regarding damaged caused to components due to overheating primarily with a heatgun? I'm having a hard time getting engineering to comply. Thanks
Electronics Forum | Tue Jan 31 13:41:12 EST 2006 | outgasser
We are currently experiencing problems with delamination during rework/2nd op activity on lead free. I am suspecting this is a result of the use of a heat gun to rework components. My assumption is that the high heat and time in area greatly increa
