Electronics Forum | Tue Nov 27 08:21:43 EST 2007 | shy
How many mils the gap between the terminal and pad? Your practice is for technology SMT-4? What is problem with glue cure? is it due to the reflow profile? how long the glue can be keep in room temperature with humidity 40-60?
Electronics Forum | Tue Nov 27 08:13:04 EST 2007 | davef
C1: is there any gap between the pad and terminal if we place the glue? R1: Yes, there is a gap, but it is easily bridged by the amount of solder in the wave. C2: Btw, my practice to print solder pate then punch glue then PNP component and finally
Electronics Forum | Thu Nov 29 22:38:05 EST 2007 | shy
Hi Dback, Yes, i'm open "dog bone" aperture for my chip component. this is to prevent solder ball issue. For fine pitch i'm opening square with full length and half width to prevent bridging. Btw, if "dog bone" is not for chip component, what is your
Electronics Forum | Wed Nov 28 01:07:36 EST 2007 | shy
is there any standard gap between the terminal and pad if we place the glue? SMT-4 mention as per what you understand which is using glue at SMT without solder paste and run at wave solder for the solder paste at the terminal. Glue supplier recomm
Electronics Forum | Tue Nov 27 20:19:12 EST 2007 | davef
Q1: How many mils the gap between the terminal and pad? A1: It depends on properties of the glue and z-force when the component is placed by the assembler. Q2: Your practice is for technology SMT-4? A2: We don't understand SMT4. We know that very sm
Electronics Forum | Thu Jun 20 03:29:56 EDT 2002 | Josef
I would like to ask you for help. We use mixed technology and we need to protect SMT components in double Wave. Currently we use the carrier for protection of this component. In this case this procces is not possible to use it due to gap between SMT
Electronics Forum | Mon May 12 12:58:07 EDT 2014 | emeto
Hello all, I have a diode(gold plated)on some assemblies that gives me a a hard time. The paste is wetting too good and climbs the lead of the component and touches the body which is a defect. I just wonder what if there is a way to heat the board e
Electronics Forum | Wed May 14 18:22:07 EDT 2014 | hegemon
Dave is touching on one of those magical things that keeps us process engineers well paid and dancing (Well, some of us, lol). Heavy boards with light components. Solder Follows heat. Component heat up earlier. Repeat, Solder follows the heat. Care
Electronics Forum | Tue Apr 16 05:05:32 EDT 2013 | stivais
We recently had a discussion with customer's QM - he claims that calculations for a proper solder wire diameter and soldering iron tip size (and temperature) have to be performed and documented for all manual (T/H) solderings (based on component size
Electronics Forum | Mon May 12 14:49:28 EDT 2014 | davef
Hi Evtimov 'hege gave you a plausible explanation for what's going on with solder running-up the lead of your components: TOO MUCH METAL!!! I've got different one. This explanation goes along the way that you're thinking, but just opposite. The rea
