Electronics Forum | Mon Sep 20 16:06:53 EDT 2004 | blnorman
We require that the ovens used for bake out are vented, thus removing the vapor from the oven.
Electronics Forum | Wed Sep 15 22:44:58 EDT 2004 | pdeuel
RH changes with temprature. That's why your winshield de-fogs when your defroster is on.
Electronics Forum | Mon Sep 20 16:15:11 EDT 2004 | davef
The activation energy for diffusion for molded with novolac, biphenyl or multifunctional epoxy mold compounds and air are not equal.
Electronics Forum | Tue Sep 21 00:45:39 EDT 2004 | aaronrobinson
thanks Dave, do you know where I can read a little more on this?
Electronics Forum | Tue Sep 21 06:46:58 EDT 2004 | davef
Background on activation energy for diffusion can be found: * Materials textbooks * College lectures posted on the web. Use 'google' or someother search tool. As a guideline, the higher the activation energy, the harder is is for diffusion to occur
Electronics Forum | Sun Sep 19 19:51:31 EDT 2004 | aaronrobinson
thanks for your reply ....yes the air is then able to hold more water vapour.... but so is the component hence there is no water vapour pressure difference and the component and the air in the oven would still be in equilibrium???? hence no effective
Electronics Forum | Wed Sep 15 17:53:53 EDT 2004 | aaronrobinson
My question is how does heat alone (125DegC for 48hours) diffuse the water vapour in a component, I figure the amount of water vapour in grams per cubic cm will be the same regardless of temp...yes with temp the RH changes but once the component rea
Electronics Forum | Tue Sep 03 18:14:35 EDT 2002 | fmonette
I have never heard about a requirement for temperature ramp-up for baking components at 125C. In general the concern for delamination with moisture sensitive components starts above 200C (peak body temp). Most important is you should bake your com
Electronics Forum | Wed Aug 21 07:24:12 EDT 2002 | bayanbaru
What is the correct method to bake or cure the component?Standard baking practise by us is to place the units into oven at 125 �C for 8 hrs directly. But I was told that the correct baking practise is to cool down the Baking Oven to Room temp and onl
Electronics Forum | Fri Aug 16 11:13:17 EDT 2002 | kenbliss
I have a question for everyone about component baking. In my view this is rework. The component was manufactured and shipped correctly and should not need baking in order to use it. Some how in storing the component in a stockroom atmosphere (I as
