Electronics Forum | Wed Jan 16 11:20:52 EST 2002 | bentzen
Hi... We tend to do a lot of footprint calculating for new SMD components. But what about the amount of solder paste on the solder pads. The amount of solder alloy is of cause determined by the stencil aperture size, stencil thickness and the sold
Electronics Forum | Wed Jan 16 15:22:29 EST 2002 | Terry Burnette
In his book titled "Manufacturing Techniques for Surface Mount Assemblies" author R.J. Klein Wassink describes the relationship between solder land dimensions, component lead coplanarity, board warpage, solder volumes, and solder paste flux wetting b
Electronics Forum | Sat Jun 26 02:32:32 EDT 2010 | prinsisgarcee
how do i calculate false call rate? i got this equation = [over reject / (total solder joints + components) ] * 1000000 and i got a table which shows data like number of solder joints, components on panel, and number of false call, and the false
Electronics Forum | Fri Jul 09 19:20:49 EDT 2010 | rway
This table, is it in a database? And is it indicating the number of component, solder insp. etc based on one board or one panel? It needs to be based on the total number of inspection on your panelized pcb. The equation works, you may just be look
Electronics Forum | Thu Apr 28 02:03:10 EDT 2005 | Yngwie
Just to check and see if I'm using the right formula in my "cost per component placement" calculation is correct or not. Any input would be much appreciated. Total cost of the machine : A Depreciates over 5 years Actual/best UPH obtained 11000 cph
Electronics Forum | Thu Aug 01 07:51:04 EDT 2002 | GregH
Are all components calculated at the same cost when calculating cost per placement? Are they categorised according to their sizes / dimensions as per machine placement speed or are they also categorised as per component technology? Can anyone give m
Electronics Forum | Thu Aug 01 07:52:37 EDT 2002 | GregH
Are all components calculated at the same cost when calculating cost per placement? Are they categorised according to their sizes / dimensions as per machine placement speed or are they also categorised as per component technology? Can anyone give me
Electronics Forum | Wed Sep 15 17:53:53 EDT 2004 | aaronrobinson
My question is how does heat alone (125DegC for 48hours) diffuse the water vapour in a component, I figure the amount of water vapour in grams per cubic cm will be the same regardless of temp...yes with temp the RH changes but once the component rea
Electronics Forum | Mon Jan 06 18:01:01 EST 2003 | dougt
This is getting deep but here's my input: Here's an idea....... Get a full reel and weigh it on a parts scale down in the stock room. Next weigh an empty reel. Subtract empty from full, and devide this value by the quantity of the full reel. This
Electronics Forum | Tue Apr 16 05:05:32 EDT 2013 | stivais
We recently had a discussion with customer's QM - he claims that calculations for a proper solder wire diameter and soldering iron tip size (and temperature) have to be performed and documented for all manual (T/H) solderings (based on component size
