Electronics Forum | Mon May 10 18:05:31 EDT 2004 | daman
We are trying to solder a Surface mount relay having lead free finish on the leads. The leads are not getting soldered down during the reflow. The leads also look oxidized (failed our solderability test) but we don't have an option but to use these r
Electronics Forum | Mon May 10 20:46:25 EDT 2004 | davef
The three basic methods you can use to restore solderability on components are: * Highly active fluxes in a retinning operation. * Surface stripping chemistry and then a standard retinning operation. * Electrochemical conversion chemistry and then a
Electronics Forum | Tue Oct 05 18:05:56 EDT 2010 | jry74
I have seen an increase in components with contaminated leads, mostly SMT parts. They give us solder wetting problems and insufficient solder joints. Our practice is to not use them and return them to the manufacturer. Are these parts solderable?
Electronics Forum | Tue Oct 05 18:06:21 EDT 2010 | jry74
I have seen an increase in components with contaminated leads, mostly SMT parts. They give us solder wetting problems and insufficient solder joints. Our practice is to not use them and return them to the manufacturer. Are these parts solderable?
Electronics Forum | Tue Oct 05 18:06:53 EDT 2010 | jry74
I have seen an increase in components with contaminated leads, mostly SMT parts. They give us solder wetting problems and insufficient solder joints. Our practice is to not use them and return them to the manufacturer. Are these parts solderable?
Electronics Forum | Tue Oct 12 13:07:49 EDT 2010 | markgray
Baking of the component helps it depends on the type of contamination and how much contamination. It sounds like your purchasing is buying from brokers.
Electronics Forum | Mon Feb 21 08:39:10 EST 2005 | pemnut
There are so many variables to this. It could be paste, pad size, contaminated components-pads, placement speed, component thickness being wrong in the program, dropping parts into the paste instead of placing them, component recognition ploblems. Is
Electronics Forum | Wed Dec 18 19:52:25 EST 2002 | kennyg
Problem: A SMT fine pitch or BGA component needs to be baked due to MS concerns and is needed in a hurry. In some cases the packaging will not allow a high temp/short duration bake. Production will not allow a low temp/long duration bake. If the part
Electronics Forum | Fri May 11 07:37:22 EDT 2007 | davef
IPC-A-610D 3 Handling Electronic Assemblies 3-1 3.1 EOS/ESD Prevention 3-2 3.1.1 Electrical Overstress (EOS) 3-3 3.1.2 Electrostatic Discharge (ESD) 3-4 3.1.3 Warning Labels 3-5 3.1.4 Protective Materials 3-6 3.2 EOS/ESD Safe Workstation/EPA 3-7 3.3
Electronics Forum | Thu Jun 12 00:28:28 EDT 2014 | ericchien
Hi Martin, Just wondering do you wish to test the component? I and my company may identify what is the foreign contaminants of it. Most probably is the flux deposits though. Anything you want to inspect you might get to me at +65 94870818.
