Electronics Forum | Mon Jul 10 21:01:06 EDT 2000 | Dave F
Edmund: Responding to your questions: 1 What is purpose of using DI water to wash a PCBA? Compared to tap water, DI water is less likely to leave: � Metal cations on sensitive components. � Salts of Ca, Mg, and other stuff on metals on the assemb
Electronics Forum | Mon May 15 11:03:13 EDT 2006 | Pitt Bull
Can lead free components/assemblies be contaminated if reflowed in a reflow oven for leaded process?
Electronics Forum | Fri Jul 13 16:45:37 EDT 2007 | losersk8er
The Contamination has proven to be pretty random, lots of stainless steel though in fact two cases in the past two days. As far as I know all machinery is cleaned regularly as well, even the stencil washer itself. The boards we make are 90% (at l
Electronics Forum | Wed Jun 17 16:08:37 EDT 1998 | upinder singh
We are facing a problem of high contamination on boards after wave soldering. We want the contamination to be under 24 ugm/inch square. We are using a no clean flux with the spray fluxer unit of wave soldering. The contamination is higher on the end
Electronics Forum | Mon Feb 21 08:39:10 EST 2005 | pemnut
There are so many variables to this. It could be paste, pad size, contaminated components-pads, placement speed, component thickness being wrong in the program, dropping parts into the paste instead of placing them, component recognition ploblems. Is
Electronics Forum | Mon Mar 17 07:00:34 EDT 2008 | ectan5117
Hi, During SMT process, i found that solder splash on the gold pad. The distance between the COB pad with component pad is about 1.25mm. My question is what material can used to cover the COB pad without bringing contamination. And i am welcome to
Electronics Forum | Wed Jun 17 16:19:10 EDT 1998 | Ryan Jennens
| We are facing a problem of high contamination on boards after wave soldering. We want the contamination to be under 24 ugm/inch square. We are using a no clean flux with the spray fluxer unit of wave soldering. The contamination is higher on the e
Electronics Forum | Wed Dec 18 19:52:25 EST 2002 | kennyg
Problem: A SMT fine pitch or BGA component needs to be baked due to MS concerns and is needed in a hurry. In some cases the packaging will not allow a high temp/short duration bake. Production will not allow a low temp/long duration bake. If the part
Electronics Forum | Fri May 11 07:37:22 EDT 2007 | davef
IPC-A-610D 3 Handling Electronic Assemblies 3-1 3.1 EOS/ESD Prevention 3-2 3.1.1 Electrical Overstress (EOS) 3-3 3.1.2 Electrostatic Discharge (ESD) 3-4 3.1.3 Warning Labels 3-5 3.1.4 Protective Materials 3-6 3.2 EOS/ESD Safe Workstation/EPA 3-7 3.3
Electronics Forum | Thu Jun 12 00:28:28 EDT 2014 | ericchien
Hi Martin, Just wondering do you wish to test the component? I and my company may identify what is the foreign contaminants of it. Most probably is the flux deposits though. Anything you want to inspect you might get to me at +65 94870818.
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