Electronics Forum | Mon Sep 25 08:24:25 EDT 2017 | directx995
At the moment we do it like this: We get .csv or .txt pick and place file and .csv or excel bom file. Then I verify every single placement manualy with BOM and delete placements that are not listed on BOM. (Yes, you are right, I do it for 30 placeme
Electronics Forum | Wed Aug 05 09:41:50 EDT 2015 | kmots15
For upside down and rotated parts try using the index mark (F6) in the package database for that component, at least then the machine should look for a unique feature on the bottom and if it cannot find it the part will be rejected. For the index ma
Electronics Forum | Tue May 03 10:32:10 EDT 2016 | swag
Couple idears for you: I've got this error when the program is jacked up, specifically component. In particular from what I remember, GSM or Advantis will give that error when a ball grid array with multiple patterns doesn't add up to a perfect mul
Electronics Forum | Tue Sep 28 10:29:11 EDT 1999 | Earl Moon
| Dear all, | | We've got a curious problem. We have had a major problem with BGA's occasionally being placed one to several rows or columns off the pads. We are using Universal's GSM2 platform for our general purpose placements. Our Universal re
Electronics Forum | Thu Oct 07 21:48:52 EDT 1999 | JAX
| Dear all, | | We've got a curious problem. We have had a major problem with BGA's occasionally being placed one to several rows or columns off the pads. We are using Universal's GSM2 platform for our general purpose placements. Our Universal re
Electronics Forum | Mon Oct 23 06:50:06 EDT 2017 | spoiltforchoice
For package shapes/names I would recommend using manufacturer names. This is much safer than coming up with descriptive names like QFN32_5x5 as there are multiple 5mm 32Pin QFN shapes even when pitch is the same, this makes it safer to use a name in
Electronics Forum | Wed Oct 13 05:46:27 EDT 2004 | apetkov
Hi Do you know about some kind of database (library) with physical specifications of the most widely distributed SMD Components. Something like BGA, QFP, SOP, etc. and for each corpus width, length, pins, etc. JEDEC has something similar, but t
Electronics Forum | Fri Apr 06 16:17:07 EDT 2007 | pima
Let me just shortly explain why do I open this thread. In my corporation in different plants we use same components at the same machines in different products(Fuji machines). I would like to create kind of global database of shapes ( its in FujiFlexa
Electronics Forum | Wed Mar 31 09:05:36 EST 2004 | russ
That would be one BIG spreadsheet, there are a lot of mfg with a lot of components for each one. As you know when going to the datasheetlocator you notice the huge listing of suppliers (500+) each one of them probbaly has anywhere from 1 type of co
Electronics Forum | Sat Mar 25 16:57:30 EDT 2017 | zippi
Hi, Our Company write a new software to Convert p&p files to assembleon text or xml file. We use it with an Ellipse 2, topaz X and an OPAL XII. You can check all positions compare with Gerber, set database number and compare component size, set fidu
