Electronics Forum | Fri Jul 24 16:33:45 EDT 2015 | cnotebaert
You should be fine! best practice for a situation like this would be to run a solder sample, either flux it and run through wave, or screen print, don't place parts and run through reflow. look for proper wetting characteristics if you see de-wetting
Electronics Forum | Sun Aug 31 07:13:13 EDT 2008 | allan99
All that they are telling is important (variants in the process), what you can do in a fast way is: change the component for a new one (date of manufacture / other supply - if you have); change the component (test - same package but other specificati
Electronics Forum | Tue Jun 20 21:55:42 EDT 2006 | davef
Questions are: * What is your concern about this capacitor? * Are you running a leadfree process? * Is the component leadfree? Generally, we are ecstatic when compoents are on tape and not in plastic bags. And if they solder, well, we're dancing in
Electronics Forum | Thu Aug 29 17:45:54 EDT 2002 | nifhail
What are other testing/process step that we should do if we where to use the old date code QFPs other than solderability and baking ? What is the plating composition normally %? lead, % tin etc. I have my policy not to accept the more than 12 mont
Electronics Forum | Sat Jun 30 11:03:29 EDT 2001 | davef
Nice to have you back on SMTnet. Some of the newer folk have missed-out on the solid contributions you�ve made to the Forum. The chicken wire cleaning basket was a classic!!! [It�s a shame that the folk at SMTnet can�t recover those files.] We bu
Electronics Forum | Fri Aug 16 18:23:48 EDT 2002 | kenbliss
Hi Dave Interesting points. If I understand you correctly 1. about 2% of part numbers have a moisture problem 2. Packaging frequently comes in with expired dates on them. This seems hard to believe you would accept them. 3. To really solve the
Electronics Forum | Wed Jun 21 13:06:02 EDT 2006 | grantp
Hi, If your worried about them being lead free components, because it's "not clear" then you should be able to ask the manufacture of them if they are lead free, as they normally trace the batch code, and manif date and will know for sure. Most pas
Electronics Forum | Wed Jul 02 07:00:56 EDT 2003 | davef
Title : SOLDER JOINT RELIABILITY OF Sn-Ag-Cu BGA COMPONENTS ATTACHED WITH EUTECTIC Pb-Sn SOLDER PASTE Author : Fay Hua et al. Author Company : Intel Corporation Date : 01/01/2003 Source : Journal Of Surface Mount Technology, Volume 16-
Electronics Forum | Tue Feb 15 21:27:18 EST 2005 | davef
Component shelf life depends on: * Solderability protection type. * Quality of process and materials used in applying solderability protection. * Duration of time from when the solderability protection was applied. * Packaging used in component stor
Electronics Forum | Fri Mar 06 12:02:36 EST 2015 | saoasasd
So far we have tried diferent date codes, solder pastes and PCBA models (same component used in different projects). We have also sent some components for plating analysis and we are waiting the LAB feedback. Additionally, we have tried components wi
