Electronics Forum: component failure (Page 1 of 44)

Component failure analysis

Electronics Forum | Tue Jul 19 14:29:12 EDT 2005 | ppwlee

What are possible failure analysis (destructive or non-destructive and what are the pro/cons) I could conduct on the component level (of an IC) to determine failure mode/root cause? We are measuring internal shorts between leads on a SOIC after sold

Component failure analysis

Electronics Forum | Thu Aug 11 08:23:29 EDT 2005 | jbragg

Hi Peter, I'm not sure where you're located, but I work for Celestica in our Component Failure Analysis and Reliability Testing Lab in Toronto Ontario Canada. We are an idenpendent lab with full FA component, assembly and PWB capabilities and would

Component failure analysis

Electronics Forum | Tue Jul 19 17:48:16 EDT 2005 | saragorcos

One step is to examine the cleanliness on and around the failing component. There could be an ionic contaminant causing the shorts. Regards, Sara Gorcos www.residues.com

Wire bond failure

Electronics Forum | Thu Jan 15 15:16:56 EST 2009 | jsherrow

We recently had our customer report a component failure trend of a few percent. Analysis indicates wire bond failure internal to a d-pak caused by what appears to be chlorine contamination. We're running a lead free process with aqueous wash. 700 co

MELF component/solder failure

Electronics Forum | Tue May 06 15:09:33 EDT 2003 | russ

Is that coating pliable? How is it cured? Russ

Component failure analysis

Electronics Forum | Tue Aug 23 13:25:10 EDT 2005 | MMurison

MUAnalysis is an independent lab for Component Failure Analysis and Reliability Testing in Ottawa, Ontario Canada. We also would be pleased to discuss your analysis needs. We also perform all non-destructive testing, e.g. visual, x-ray, C-SAM, el

MELF component/solder failure

Electronics Forum | Thu May 01 20:40:15 EDT 2003 | davef

Are you talking to these guys? http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=24298

MELF component/solder failure

Electronics Forum | Tue May 06 15:53:52 EDT 2003 | bremerg

The coating is pliable and is air cured for 24 hours. The potting compound goes into the top assemnbly in 3 diferent stages. The circuit boards are coated using urethane type conformal coating. The unit is also placed into an ESS chamber -40� to +

MELF component/solder failure

Electronics Forum | Thu May 01 13:58:14 EDT 2003 | bremerg

Gentlemen, Does anyone have any failure information on IRC, CHP2-100-R500F (5 OHM, 2W, 1%) resistors. We have experienced two failures on the same circuit board where the metalization on the component separated from the component causing an open ci

MELF component/solder failure

Electronics Forum | Tue May 06 14:52:37 EDT 2003 | bremerg

Pictures are now located at http://www.stevezeva.homestead.com/ These components are 2W resistors that only see 1/2W at max. during normal use. I have contacted IRC still wqaiting for a response. The resistors were tested as good. But the circuit

  1 2 3 4 5 6 7 8 9 10 Next

component failure searches for Companies, Equipment, Machines, Suppliers & Information

Sell Used SMT & Test Equipment

High Precision Fluid Dispensers
AI Data Center Hardware Manufacturing

Best Reflow Oven
Formic Reflow Soldering

World's Best Reflow Oven Customizable for Unique Applications
PCB Handling with CE

Smt Feeder repair service centers in Europe, North, South America