Electronics Forum | Fri Oct 08 09:08:32 EDT 2004 | russ
I've never had one "float" in the wave. Have you tried waving yet to see? Anyway, glue would work, or you could place a a small weight on top, or clinch a couple of leads. Russ
Electronics Forum | Tue Nov 27 14:56:33 EST 2007 | jaimebc
Shy, What is your current method of applying adhesive? If the terminals of the component that has adhesive are not wetting ( or not forming a solder joint I think we are talking about ) after reflow, then you must be applying too much adhesive. As
Electronics Forum | Sun Mar 16 20:46:18 EST 2003 | MA/NY DDave
Hi Good, that is one of the things I see some have done. With paste too thick these little components float too much off, rather than centering. YiEng, MA/NY DDave
Electronics Forum | Wed Nov 03 22:14:03 EST 1999 | Dave F
Anthony: John's points are well taken. All SMT components float to some degree. Fly shit floats more than multi-lead. Well duh!!! I know of no formula. The most cogent discussion is in THE BOOK (Klein Wassink's "Soldering In Electronics), but i
Electronics Forum | Sun Mar 31 22:50:28 EST 2002 | ianchan
Nope, we do not have solder beads, like we said, what we have are near perfect solder fillets except for the portion where the component is "floating OFF" the pcb pads. We are now mucking through the IPC-A-610C for specifications dictation on "tilted
Electronics Forum | Fri Nov 17 15:04:59 EST 2006 | ehess
WE have a problem with a DPAK component floating during reflow, causing it to move to the point where it affects the toe fillet. We have been using a dot of SMT epoxy to hold it secure for the moment. I have looked on many sites, but no whrere can
Electronics Forum | Mon Dec 27 19:10:58 EST 2021 | ppcbs
The component should float into place provided you have the correct amount of solder paste. Perform a solderability test on the pads. We have come across new components with oxidation that prevents wetting. This will cause components to not self ali
Electronics Forum | Mon Jan 07 07:05:19 EST 2008 | PitPony
In the next couple of weeks I will be attempting to place 0402's and 0603's using a Quad QSA-30. I am a little nervous as I have heard along the grapevine that the machine struggles in placing the smaller components as they float around in the pocke
Electronics Forum | Thu Jul 06 07:40:51 EDT 2000 | Christopher Lampron
SAL, How large is the pad in relation to the solderable area on the component. I have seen similar instances where the heat sink of the component covered almost the entire bottom of the part. If your pad is the same size and the aperture is 1:1, ther
Electronics Forum | Wed Jul 25 11:16:34 EDT 2007 | lloyd
Hi Folks, I hope someone can help me, Is the homeplate stencil design (for reduced solder paste) the same for preventing solder balls as it is for reducing tombstones? i.e. the reduction of solder paste under the component termination. I'm trying to
.gif)
