Electronics Forum | Thu Jun 25 05:19:39 EDT 2020 | SMTA-Davandran
Dear all, Anyone know what is minimum gap between SMT component.? Anyone have design guideline for it.
Electronics Forum | Thu Dec 07 14:28:25 EST 2006 | russ
Bad design if you have to have a perfect 1206 part. you will always have a lift of some sort when reflow soldering. Solder is 3 dimensional, therefore you cannot get any underneath component, thus eliminating the automated SMT process. Cannot glue
Electronics Forum | Fri Dec 08 16:54:42 EST 2006 | flipit
My experience with SMT LED packages is that certain LED package styles tend to float. This floating is caused because the LED is often only terminated on the bottom side of the LED package. Sometimes the LEDs are terminated like a SMT resistor with
Electronics Forum | Fri Sep 18 12:21:03 EDT 2009 | kennyg
Does anyone have any off-the-shelf tool for measuring air gaps under components? Specifically to measure if a part is raised beyond special specifications, such as determining if a leaded connector is raised beyond 5, 10 or 20 mils from the PCB surf
Electronics Forum | Thu Dec 17 10:54:43 EST 2020 | spoiltforchoice
Unless you have a firm grasp on the circuit and electronics in general, you are on a hiding to nothing. Testing components in circuit is complex, because its a circuit and any measurement you make is affected by connected neighboring ones. If you set
Electronics Forum | Fri Oct 08 02:18:28 EDT 2004 | tayronnie
Hi, I need to keep the gap between the T039 component's flat base and the PCB at
Electronics Forum | Thu Aug 29 20:34:02 EDT 2002 | ppwlee
A gap of 150-200� between potential shadow components is enough to eliminate those problems. Dave, Can you clarify? Do you mean 0.015 to 0.02?? Peter
Electronics Forum | Thu Aug 29 20:01:23 EDT 2002 | davef
Many people use the same spacing [and pad designs] as they use for primary side SMT. We don�t. DOWN STREAM SMT-TO-SMT SPACING: In addition to proper orientation, components cannot be immediately upstream of terminations that are to be soldered or b
Electronics Forum | Wed Feb 02 03:32:08 EST 2000 | pascal MATHIEU
emmanuel : i agree with Dave , it's easy to have blind hole on the bottom side , of course in this case you'll lose some thermal efficiency ;the second solution is to put on the bottom side between the board and your heatsink a soft thermal interfac
Electronics Forum | Tue Nov 27 20:05:31 EST 2007 | shy
Dback, Current method is by using dispenser machine to dispense the glue at PCB. This non-wetting is randomly and not repeating to the same location. My adhesive height is 0.01" to 0.035". Is this will cause the component to had a gap between the t
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