Electronics Forum | Sun Mar 12 13:09:33 EST 2000 | Jeff Wilson
Jeff, The problem you are describing MAY be related to the push up pin setting on your component feeder units. Please verify that the push up pin height is set correctly for the feeder units, and the nozzle pick-up and placement heights are to the c
Electronics Forum | Wed Jun 03 08:51:07 EDT 1998 | Pat Copeland
Can anyone tell me if there is a reference for smt component height specs on the bottom side of a board, which will also go through wave soldering. A current design I am reviewing has tant caps(7343) and a crystal on the back side. Should I only be
Electronics Forum | Thu Aug 21 15:50:12 EDT 2003 | davef
Couple of points are: * You're technically correct that ball height has the potential to vary by 8 thou, but we never see that much variation. Ball heights within a lot of components vary just about nil. * When we place BGA, we smush them into the p
Electronics Forum | Thu Mar 03 11:10:20 EST 2005 | Dougs
I'm telling you i've bought the nozzles wound the wrong way and it helped, no more probs with nozzles sticking, i'd tried buying fuji nozzles, checked all my component heights, set Z0 properly, checked shaft heights, set up st1, etc etc but the new s
Electronics Forum | Wed Apr 23 10:19:53 EDT 2008 | mikesewell
Has anyone tried to increase the working height on their Mirtec AOI. We have several MV-2HTL machines and have a few boards that are over 2" tall. I'd rather not leave the parts out and have a secondary step to install them after inspection. I've
Electronics Forum | Thu Aug 21 08:33:09 EDT 2008 | davef
There is no standard as such. It's easy to see why. It's too complicated and has such a small payoff. Standoff is comprised of: * Package height * Solder thickness between the pad and the component lead * Delta of pad thickness and solder mask For p
Electronics Forum | Thu Aug 08 22:41:30 EDT 2019 | orbitcoms
The pick n place height for component was set to 1.4mm but I had not allowed for pin thickness. I added this (total height now 1.6mm) and I get very few solder bridges now. I might try 1.7 and see if it makes any further differnce
Electronics Forum | Wed Jun 03 10:25:49 EDT 1998 | Justin Medernach
| Can anyone tell me if there is a reference for smt component height specs on the bottom side of a board, which will also go through wave soldering. A current design I am reviewing has tant caps(7343) and a crystal on the back side. Should I only b
Electronics Forum | Sat Mar 18 07:43:25 EST 2000 | Dave F
Larry: I'd like to see your angle increased generally and that could fix your problem. Lots of other things can cause skips, such as: * Wave height, your might be high with 2" of contact * Flux contamination, activity * Component contamination * C
Electronics Forum | Wed Jul 04 11:07:46 EDT 2001 | a.m.
Hi Mike, What type of component you have the problem? For a quick refernce you have two points for the ideal dot: 1- Dot size = 2/3 of area of glue (pad to pad) 2- Dot height = pad thickness + component stand off
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