Electronics Forum | Thu Mar 05 20:32:17 EST 2009 | davef
Most likely, placing components will smush the higher points on the edges of your paste deposit
Electronics Forum | Fri Apr 17 07:45:43 EDT 1998 | Robert Meston
We have to mount our SMD devices 0.1 to 0.4 mm off the pcb PCb substrate to compensate for thermal stressing in a Space enviroment. Has any one any ideas or contacts for dissolvable pads. this only applies to leadless components
Electronics Forum | Mon Feb 21 03:51:37 EST 2005 | abhirami
Solder paste thickness control is more important in SMT process. What controls do you have? I guess if everyone follows the critical control path, then there are always reduced problems. The issue is no one is perfect. Paste tends to be on the stenci
Electronics Forum | Fri Apr 17 14:37:13 EDT 1998 | Justin Medernach
| We have to mount our SMD devices 0.1 to 0.4 mm off the pcb | PCb substrate to compensate for thermal stressing in a | Space enviroment. Has any one any ideas or contacts for | dissolvable pads. this only applies to leadless components Robert, Try
Electronics Forum | Wed Oct 26 14:29:55 EDT 2005 | barryg
We have a class 3 assembly we will be doing soon and I was wandering since the fillet heighth required for class 3 is 50% more than class 2, should I have my stencil thickness increased from 6 mil. to 7 mil.? This assembly is made up of 31 mil. pitch
Electronics Forum | Mon Feb 21 04:04:21 EST 2005 | abhirami
1.67 always on the sample boards measured. This is very fast and pretty good measurement for a paste dispense control. Boards do not stand out-side for long times. Inspect the height for critical components only, in the initial stages. Once your Cpk
Electronics Forum | Fri Jan 24 08:14:24 EST 2014 | davem
m_imtiaz, Over the last 15 years or so I've found that using the stencil foil thickness +2mils/-0mils has worked very well. For example, if you have a 5mil stencil thickness your upper control limit would be 7mils and your lower control limit would
Electronics Forum | Sun Apr 19 13:52:45 EDT 1998 | D.Lange
| We have to mount our SMD devices 0.1 to 0.4 mm off the pcb | PCb substrate to compensate for thermal stressing in a | Space enviroment. Has any one any ideas or contacts for | dissolvable pads. this only applies to leadless components Robert, PPI
Electronics Forum | Sun Apr 19 13:50:41 EDT 1998 | D.Lange
| We have to mount our SMD devices 0.1 to 0.4 mm off the pcb | PCb substrate to compensate for thermal stressing in a | Space enviroment. Has any one any ideas or contacts for | dissolvable pads. this only applies to leadless components Robert, PPI
Electronics Forum | Thu Mar 31 06:09:19 EST 2005 | amstech
Yes, components do contribute to the non wets in fine pitch reflow. Oxidation is the main culprit. May ask where it is coming from. Can not say in particular. May be burn in test process or end of line baking, hot / cold testing and need to run DOE'
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