Electronics Forum | Mon Dec 18 11:17:52 EST 2006 | mashmo
I am always looking for ways to make my boards more reliable and easier to fabricate and assemble. I have been baselining my footprints off of IPC-7351 and with the latest revision of the calculator they have started a new feature. Normally on say
Electronics Forum | Mon Aug 28 12:41:35 EDT 2000 | JAX
MoonMan, I'll take a crack at the list. Feel free to answer the ones I don't! 1. Solderability is a parameter which indicates how well a component can be soldered. As far as Solder Termination Coatings go, here are some up�s and down�s of a few. Ha
Electronics Forum | Tue Oct 29 15:25:12 EST 2002 | russ
Thanks for the info, I have previously not used the Ps and Qs so to speak and I am finding now that we are running into trouble mostly due to component height and body sizes. So for example we currently have "16 pin SOP" what we need is "16 pin SOP,
Electronics Forum | Mon Apr 30 18:34:35 EDT 2012 | hegemon
Pure Tin terminations can be mitigated for components with solder terminations less than .030" in height from the PCB, by using 6 mil stencil with Sn63/pb37 solder paste. That's the simple story for our customers that require it. Beyond that height w
Electronics Forum | Fri Dec 27 16:12:54 EST 2019 | anteiv
thank you for reply here is picture of the board https://imgur.com/a/i2MfFBw on the bottom are pins/components which height is about 3-4 mm from bottom of the board we had to increase distance of board from nozzle to make clearance and we increas
Electronics Forum | Wed Sep 22 10:03:07 EDT 1999 | Boca
| | | | i'm sure everyone has run into this at one point or another. I have a thin pcb .025 that is single up that has to be built on a pallet. does anyone have any tricks to the pallet design that will help to hold these boards down during the s
Electronics Forum | Wed Feb 14 21:14:45 EST 2001 | davef
BGA Shorting 1 Damaged mask in between the BGA pad and via on the substrate. 2 Poor print registration. 3 Poor via segregation from the pads? Are they tented or is there just a dam in between? 4 Review the profile. You can run into a number of p
Electronics Forum | Wed Jun 03 13:50:32 EDT 1998 | Chrys
| Can anyone tell me if there is a reference for smt component height specs on the bottom side of a board, which will also go through wave soldering. A current design I am reviewing has tant caps(7343) and a crystal on the back side. Should I only b
Electronics Forum | Wed Jul 04 11:10:56 EDT 2001 | davef
It�s tough to say. You need enough, but you can�t have too much because you slop it all over the pads, but if you have too little � well you get the picture. There�s so many ways to get to the same place. There is no standard. It�s whatever you n
Electronics Forum | Fri Sep 02 16:22:37 EDT 2011 | ttaubert
Are there SMT mechanical components like that could be used for orientating PCB-level optics on the board and do not require holes in the board? Their final position would solely depend on the reflow. A height of 1/8" would be sufficient. I was con
