Electronics Forum | Fri Jun 08 01:25:02 EDT 2018 | buckcho
Hello, good choice! Koh young makes great reports for cpk. Only one advice. If you take 50panels from production and your cpk seems low, try to group the different kinds of components. Because also cpk on a whole panel would be not good number as wel
Electronics Forum | Wed Sep 13 12:50:44 EDT 2023 | kirill
Greetings, I would like to do a height calibration, because the laser of the machine seems to be out of control, I'll explain why: When I measure the height of a 0402 resistor, I get around -0.60 to -0.70, when I fix it on what the machines has measu
Electronics Forum | Wed Apr 18 17:29:14 EDT 2018 | emeto
Can you send me a screenshot to see how it looks or a spreadsheet of the data? Do you have to modify anything on your own? Can you do it for some selected components/apertures or it has to be on the whole PCB? Any further info will be appreciated.
Electronics Forum | Mon Dec 29 14:47:36 EST 1997 | justin medernach
| how to determine the optimum solder paste height ? Ray, This is a gross misconception within the industry. There is no optimum solder paste height, per say. The effectiveness of a solder joint should be quantified in volume. Use your process as
Electronics Forum | Thu Sep 14 06:18:00 EDT 2023 | deniseburton
Hello, mcdvoice It seems like your Juki RS-1R machine's laser height calibration may be off. When measuring a 0402 resistor, it consistently reports heights around -0.60 to -0.70, causing pickup issues during production. Manually adjusting it to -
Electronics Forum | Wed Nov 12 04:34:17 EST 2008 | kywl
Hi all, Assuming that i were to design a PCB and there are multiple components, what is the minimum spacing required to ensure that i won't have problems in my SMT process later on? Also, is there a minimum component stand-off height spec as well?
Electronics Forum | Tue Jan 29 08:21:50 EST 2019 | electronics101
Hi All, Can someone please help, I have a number of tall surface mount components that according to IPC 610 (8.2.2.3) are a fail due to the end termination not wetting at least 0.5mm + solder height. The components are very well soldered but the sol
Electronics Forum | Fri Nov 14 03:41:26 EST 2008 | kywl
For your pad layout and spacing between > components, look here: _a class=roll > href="http://portal.ipc.org/Purchase/ProductDetail > .aspx?Product_code=77b562c1-b8f8-db11-8a6a-0050568 > 75b22" > target="_blank"_http://portal.ipc.org/Purchase/Pr
Electronics Forum | Tue Dec 11 19:48:37 EST 2007 | arun2382
Hi, If I were working with a 75 um thick stencil, Is there a spec. as to what the maximum value allowed on actual solder height measurements? Stencil type: Laser cut and electropolished Solder paste type: Type 4 Sn-Sb Would the measured values va
Electronics Forum | Wed Jan 30 02:50:33 EST 2019 | electronics101
Hi Steve Thanks for coming back to me, you are correct IPC class 3 is required. We are getting great wetting onto the device but not as per IPC 3 with the wetting rising about 0.25mm. I am questioning whether it is actually possible with such a (re
