Electronics Forum: component height mismatch (Page 4 of 48)

SMT Design: Package distance and stand-off height

Electronics Forum | Fri Nov 14 07:32:24 EST 2008 | davef

Yes, courtyard gives you the space requirement of a component. Sometimes, the working space of a rework tool takes precidence, though.

Fillet height of SMT chip capacitor

Electronics Forum | Wed Jan 30 13:17:22 EST 2019 | slthomas

In addition to robl's suggestions, I would look at the footprint on the board to make sure it meets the recommended dimensions. Abnormal layouts, particularly when pads extend under the component too far, can be problematic both by lifting the part

SMT Design: Package distance and stand-off height

Electronics Forum | Thu Nov 13 22:20:48 EST 2008 | davef

For your pad layout and spacing between components, look here: http://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=77b562c1-b8f8-db11-8a6a-005056875b22 For your standoff height in SMT, we do not concern ourselves with standoff height. It

FUJI CP642 narrow camera part height limit

Electronics Forum | Fri Jan 12 15:35:05 EST 2024 | madisreivik

On my CP642 I got narrow camera for 0201 parts. My question: some thick (2mm+) 0805 components look blurry. Is there a part height limit for the narrow camera ? I noticed that some parts predefined from previous owner were made to wide camera, alth

optimun height between lead and pad?

Electronics Forum | Tue Dec 04 09:48:43 EST 2001 | davef

Defining the thickness of solder between the lead and the pad, J-001 states "Properly wetted fillet shall be evident." J-001 is available from http://www.ipc.org. Factors that affect this are: * Amount and composition of solder * Amount and compo

SMT component mis-aligned

Electronics Forum | Mon Feb 21 16:06:10 EST 2005 | MR

I agree w/ JB; the package height definition is crucial. I have had problems w/ this in the past, and found that a resistor height was being used as a universal passive height for the capacitor in question. Properly defining the height fixed the pro

soldering thru-hole SAC305 component

Electronics Forum | Fri Mar 16 08:01:53 EDT 2007 | ck_the_flip

SAC coated leads on certain components require more dwell time. If you find that you have top-side wetting issues, slow the conveyor down a bit or increase your wave height, or, a combination of the 2.

Re: Misplaced QFP240 component

Electronics Forum | Wed May 17 12:22:54 EDT 2000 | JAX

Ramot, Without further explanation everyone here is just taking stabs at it..... Sounds normal, I'm game! Have you looked at board finish(HASL?)?? Measured paste height?? Are they always off in the same direction? If not, Handling?? What are the sp

0402 (1005) component

Electronics Forum | Thu Apr 28 12:23:14 EDT 2005 | Rob

Have you checked the placement height? it will need to be set down to about 0.5mm - 0.6mm, whereas you can get away with 0.9mm for 0603. Not a Panasonic expert but I've seen this nearly every time a customer has taken the step down. Cheers, Rob.

How to calculate BGA height change after reflow oven?

Electronics Forum | Mon Jul 06 18:00:16 EDT 2015 | jwqc

Does any one know how to calculate BGA height change after reflow oven? I guess the calculation will be based on the component size, weight, ball diameter and ball count of the BGA, but how to get the actual height?


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