Electronics Forum | Thu Apr 28 15:56:44 EDT 2005 | stepheniii
Hopefully it is just the part data a little bit off. But if that doesn't help, make sure the thickness sensor is calibrated bang on. And do the nozzle height adjustment. What are your nozzles and filters like, as far as being clean goes? I've put dow
Electronics Forum | Tue Jan 09 12:51:14 EST 2007 | aj
All, We have ran a few revisions of a New Product which is a tracking device using satellite navigation. The protos went well but now they have added a shielding can. We place 2 of these to cover the Frontend of the PCB. The test guys are having d
Electronics Forum | Tue Jul 07 10:25:03 EDT 2015 | swag
Dial indicator on a post/base. You might need a fine point tip to get between adjascent components and the BGA. Or... if you're real fance schmancy you could use a CMM if you have one.
Electronics Forum | Fri Aug 30 16:47:56 EDT 2002 | davef
Ooops, sorry Peter. [Those pesky decimal points.] I meant to say �150-200 thou�. There is a fair amount of 'Kentucky Windage' in this due to: * Height of the component and the down-stream spacing. * Chip wave capabilities.
Electronics Forum | Fri Dec 27 13:16:18 EST 2019 | slthomas
Can you describe the failure mode of the soldering defect, i.e., is it failing to meet the height requirement for a castellated termination due to not wetting of the component terminations, or not wetting the pads sufficiently, or....? We install a
Electronics Forum | Thu Jan 27 10:22:21 EST 2000 | JAX
Dennis, Not sure why your so secrative about what machine but I guess it doesn't matter. When you start placing 0402 & 0603 packages the difference between height and width and length gets lost in tolerance. This allows the machine to pass parts t
Electronics Forum | Fri Dec 27 12:47:21 EST 2019 | ameenullakhan
Dear Team, We are facing open solder issue in a sensor component. Rejection rate is 2 out of 50 components placed. The issue is very random. We have tried increasing the solder paste height from 5 mil to 7 mil. The issue persist still. Differen
Electronics Forum | Tue Nov 27 20:05:31 EST 2007 | shy
Dback, Current method is by using dispenser machine to dispense the glue at PCB. This non-wetting is randomly and not repeating to the same location. My adhesive height is 0.01" to 0.035". Is this will cause the component to had a gap between the t
Electronics Forum | Tue Nov 27 14:56:33 EST 2007 | jaimebc
Shy, What is your current method of applying adhesive? If the terminals of the component that has adhesive are not wetting ( or not forming a solder joint I think we are talking about ) after reflow, then you must be applying too much adhesive. As
Electronics Forum | Mon Nov 26 21:41:09 EST 2007 | davef
Shy: Oh, we NOW understand what you're asking. Sorry to be so dense. We agree that the standoff of component from the board could end-up being a little heigher than the pad height when using chipbonder adhesive. We rarely see a problem.
