Electronics Forum | Tue Jul 19 08:26:46 EDT 2016 | pavel_murtishev
Aleksander, The answer is no. Solder deposit being printed is 80um-150um in height depending on PCB design what is two times higher than any track covered by solder mask. Molten solder will merely center the component. QFNs are prone to soldering
Electronics Forum | Mon Jul 18 12:24:53 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Mon Jul 18 12:25:30 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Sat Jun 05 13:38:22 EDT 2021 | ppcbs
For Linear Tech LGA's we solder bump the LGA using a .30mm solder ball then reflow with a tacky flux. This will provide a void free solder joint and adds a little height to the solder joint in case you use a flux that you want to clean from under th
Electronics Forum | Mon Nov 06 14:21:09 EST 2000 | Kevin
Masking thickness can also play a factor in tombstoning (or the Manhattan Effect). If the pad is 2 mils or more below the surface of the masking this can create a problem. Depending on the thickness of the solderpaste deposition, the solder height
Electronics Forum | Wed Feb 09 09:54:50 EST 2000 | JAX
Trying to place PTH components with an SMT machine is possible but maybe not plausible. Would you have to buy specialized tools and equipment for the job ( gripper nozzles ). Are the machines you have capable. i.e.. Would you need camera modification
Electronics Forum | Tue Mar 20 22:53:16 EDT 2018 | maustin
OK, with my masterful powers of deduction, I have been able to resolve the problem. Upon further investigation, it became apparent that the issue was restricted to those components that had the laser alignment level in the component data set to -0.2
Electronics Forum | Mon Aug 24 21:16:57 EDT 2020 | smith88
I am trying to teach a class and the question came up about loss of metalization of the Earth pad on a chip filter. This pad is on the side of the component. I can not find a IPC call out for this type of side termination other than 3 or 5 sided 9.1.
Electronics Forum | Tue Dec 21 12:11:06 EST 2021 | jseewald
You likely have raised belly pads. If possible, do a step-up on the thermal pads to compensate for the additional height of the component in this area. Some reduction/adjustment of the gullwing pads may be necessary, so be prepared for a few iterat
Electronics Forum | Sat Mar 01 08:17:40 EST 2003 | davef
You're correct that the FR4 is probably the best choise. The majority of the problems in developing your reflow recipe is going to come from the CTE mismatches in the CCBGA , CBGA and PBGA that you put on the board. The other side says given the pr
