Electronics Forum | Thu Jun 15 07:20:23 EDT 2006 | William G.
How are your experiences with stencilling 0201 components on large circuit boards, i.e. 400 * 250 mm ? Will there not be too much mismatch between between stencil and (FR4) boards? If so, would dispensing be a solution? Any other solutions?
Electronics Forum | Sat Jan 08 06:37:44 EST 2022 | jineshjpr
Hi, Noticed that MPN--MAL215099913E3 used in one of our assembly with 22mm component height. In General 15mm height is right to set height calibration (98 % of the parts will be covered with this height dimensions except specific Connectors, Transfor
Electronics Forum | Tue Dec 26 11:26:00 EST 2000 | acahill
If you have a known problem with the parts, then Reject them back to the Vendor. It appears that you have a solderability issue. As for Tombstoning on 0402 chips, this could trace back to the stencil design and/or machine placement. Define Tombstoni
Electronics Forum | Mon Aug 21 19:35:51 EDT 2000 | Dave F
Kyung Sam Park: Sure, several causes of plastic QFP package delamination, other than humidity absorption, are: * Corrosion on component leads * CTE mismatch between leads and package materials * Package material adhesion strength degradation Wh
Electronics Forum | Thu Aug 24 13:51:24 EDT 2000 | Dr. Ning-Cheng Lee
Low temperature aggravates the mismatch in thermal expansion between solder and parts and between components and boards, therefore can induce earlier failure. The low temperature screening test should not be as effective when used on soft solders su
Electronics Forum | Fri Jan 13 12:36:48 EST 2023 | servin6154
There are a couple of things you can try that seemed to help me with this problem. 1.Get your HMS height off of the paper tape halfway between the pocket and the edge of the tape. 2. Change your "pick stroke" for that part to "0" 3. Check you compon
Electronics Forum | Thu Jul 20 17:03:09 EDT 2000 | Darby
Ketan, If you are using a z-axis head, pay very careful attention to the pick up height so that you don't force the head into the component. Also pay very careful attention to the placement height, we set the component height to 0.05 to 0.1mm over th
Electronics Forum | Tue Dec 06 18:29:45 EST 2005 | darby
You may also wish to check the speed controllers for both descent and ascent. The higher the ascent speed the more force the jaws close with. It can be difficult to achieve a "good" nozzle placement height as this is mechanically set and your lowest
Electronics Forum | Thu Sep 06 20:26:07 EDT 2001 | Eric
We see alot of missing component ( on/off ) after chip mounter, and had check on the component height, is correct. Nozzles had change, vaccume strong enough and table height. But we still have missing component.
Electronics Forum | Thu Aug 26 07:35:32 EDT 1999 | Robert Meston
For space contracts we have to mount chip capacitors/ resistors etc 0.1 to 0.4 mm from the pad height. This is to compenstae for the CTE differential in the substrate/component and also to ensure cleanliness. Does anyone have any new ideas on how t
