Electronics Forum | Sun Oct 27 07:56:58 EST 2002 | wongmanchung
Does any expert here know the specification of board deflection when we mounting component by pick and place machine? That is when the nozzle place the chip on the pcb, the board will have some deflection. And are there any requirment that we need t
Electronics Forum | Wed Oct 30 01:23:19 EST 2002 | jasper
Normally warp max 1% of diagonal board measurement is acceptable. What's your p&p like? Some will not experience problems at all! reg Jasper
Electronics Forum | Wed Nov 06 12:52:28 EST 2002 | charlie
Check out one of the board suppport that are currently available: Grid-Lok, Formflex and others. These systems are available for many models of printers and P&P. They automatically set up to any board, first or second side, and provide excellent su
Electronics Forum | Mon Oct 28 07:07:39 EST 2002 | cyber_wolf
It has been my experience that when all conditions are as they are supposed to be there should be zero or very little deflection. When you start placing components with pick and place equipment that does not have a Z pressure sense, you run the possi
Electronics Forum | Wed Oct 30 01:23:22 EST 2002 | jasper
It has been my experience that when all > conditions are as they are supposed to be there > should be zero or very little deflection. When > you start placing components with pick and place > equipment that does not have a Z pressure sense, > yo
Electronics Forum | Mon Oct 28 18:59:25 EST 2002 | tkenny007
Specs for Bow and Twist for PCBs (IPC-A-610C, 10.6. There may be an update by now). I also have a note in our quality guide referencing (IPC-TM-650, 2.4.22) and (MIL-STD-105D). In summary, a PCB should not bow more than 0.040" with all four corner
Electronics Forum | Wed Nov 12 06:23:09 EST 2008 | griffin
One thing to consider regarding the capacitor, The leads are not 100% straight beneath the plastic bottom part. And if you align with regards to the two leads, the leads will be aligned to the pads of your board, but the body of the capacitor is look
Electronics Forum | Sat Apr 25 19:40:01 EDT 1998 | Stan Traxler
| We have to mount our SMD devices 0.1 to 0.4 mm off the pcb | PCb substrate to compensate for thermal stressing in a | Space enviroment. Has any one any ideas or contacts for | dissolvable pads. this only applies to leadless components We have appl
Electronics Forum | Thu Feb 04 20:31:10 EST 1999 | Dave F
| I'm researching SO-8 power RF device mounting methods. | | Possible mounting method | | 1. Via thru holes | | Still the thermal resistance of the PCB too high | | Do you have suggestions for mounting the component, PCB/? | Joni: What is it ab
Electronics Forum | Fri Feb 05 04:18:44 EST 1999 | Joni Siipola
| Joni: What is it about your situation with the board/component/process that makes you want to explore alternatives? Dave F Dave: In our case the component is placed on metalled footprint which has via holes to transfer the heat via holes to the
