Electronics Forum | Thu Jun 20 03:29:56 EDT 2002 | Josef
I would like to ask you for help. We use mixed technology and we need to protect SMT components in double Wave. Currently we use the carrier for protection of this component. In this case this procces is not possible to use it due to gap between SMT
Electronics Forum | Thu Jun 20 08:47:51 EDT 2002 | Patrick
I would suggest you try the acrypeel 2000 peelable mask from Interflux USA. Try this link for more info http://www.interfluxusa.com/Datasheets/Acrypeel2000.htm Good Luck
Electronics Forum | Thu Jun 20 08:31:36 EDT 2002 | davef
You can use a peelable, rather than a water washable, temporary solder mask? Points are: * Vinyl peelable is preferred over latex, because of lower residues. You should be very concerned about this since you are probably running a low residue proce
Electronics Forum | Thu Jun 20 14:39:35 EDT 2002 | russ
I use TechSpray Wsol 2204-8SQ. This is a water soluble mask that is very thick and works pretty well for this application. Drying time depends on thickness and you should let it dry at least for a little while prior to running through the wave. Ea
Electronics Forum | Thu Nov 08 03:12:12 EST 2001 | Tom
I want to know the standard of component footprints, especially the dimensions of those component footprints. Where can I find the information?
Electronics Forum | Sun Oct 09 11:16:06 EDT 2016 | mekmat
Hello, I would like to ask you about the minimal distance between components and border of pcb especially V-cut to avoid crack of component during depaneling? I need some standard (IPC or something) where is this defined? Thank you for your support
Electronics Forum | Fri Feb 28 00:41:08 EST 2020 | luciano_zhang
is it original?
Electronics Forum | Thu Nov 08 11:55:45 EST 2001 | davef
Consider searching the fine SMTnet Archives. For instance look at the following thread: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=18112
Electronics Forum | Fri Nov 16 10:22:51 EST 2001 | Steve
Try IPC-SM-782A,Surface Mount Design and Land Pattern Standard. Go to http://www.ipc.org
Electronics Forum | Sun Oct 09 16:57:30 EDT 2016 | davef
IPC 2222A Sectional Design Standard for Rigid Organic Printed Boards, 5.3 Design Requirements for Printed Board Assembly
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