Electronics Forum | Mon Jun 20 04:21:04 EDT 2005 | alex
What is the ideal component edge to board scored edge clearance?
Electronics Forum | Mon Jun 20 09:12:55 EDT 2005 | davef
There's no easy answer. It depends on: * Thickness and size of the PCB in the array. * Means of separation. * Type of component. SMT components are more sensitive to the forces that need to be applied to separate the PCB. * Type SMT device. Ceram
Electronics Forum | Tue Jan 12 11:14:37 EST 2016 | mfgengr2016
After the CCA is been de-paneled I find exposed board fibers. Should the board edge be sealed with an epoxy to keep moisture from getting into the CCA?
Electronics Forum | Thu Jan 14 09:25:34 EST 2016 | davef
IPC-A-610F 10.2.6 Laminate Conditions - Depanelization talks to the acceptability of the depanelization criteria for assembled boards. There is no requirement for moisture sealing with epoxy or other material. Basically, the standard requires that th
Electronics Forum | Wed Jun 30 10:37:11 EDT 1999 | Boca
We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design). Inste
Electronics Forum | Sun Oct 09 11:16:06 EDT 2016 | mekmat
Hello, I would like to ask you about the minimal distance between components and border of pcb especially V-cut to avoid crack of component during depaneling? I need some standard (IPC or something) where is this defined? Thank you for your support
Electronics Forum | Sun Oct 09 16:57:30 EDT 2016 | davef
IPC 2222A Sectional Design Standard for Rigid Organic Printed Boards, 5.3 Design Requirements for Printed Board Assembly
Electronics Forum | Sun Oct 30 12:39:13 EDT 2016 | mekmat544
Thank you for your answer, but I am litte bit confusing. There are parameters of V-scoring but with put values. How can I get values for V-scoring for pcb 1,6mm thickenss. Thank you. M.
Electronics Forum | Sat Nov 05 20:23:11 EDT 2016 | sarason
Close but not to close, would have to be the spec. Or depends on your separating technology. Prerouted boards on a panel, you could go right up to the edge. V-grove you will need more distance, maybe 2mm's or more. The distance from the panel edge to
Electronics Forum | Mon Sep 06 09:03:45 EDT 2010 | aj
Hi all, Looking for some advice on how to run this component through the SMT process or is it always hand soldered? Part number is HSEC8-120-01-S-D-EM2 We are currently handsoldering. aj...
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