Electronics Forum | Fri Aug 16 18:23:48 EDT 2002 | kenbliss
Hi Dave Interesting points. If I understand you correctly 1. about 2% of part numbers have a moisture problem 2. Packaging frequently comes in with expired dates on them. This seems hard to believe you would accept them. 3. To really solve the
Electronics Forum | Thu May 10 10:17:15 EDT 2007 | pima
Hello I am looking for any standard or specification or any practise document which is talking about proper handling or how should handling look like of IC component at the section between getting component from supplier and putting it into machine.
Electronics Forum | Thu Jul 19 18:15:15 EDT 2012 | jil2000
We have a material that is been stick at cover tape, only 1 supplier is failing and only embossed tape packing is failing. A dark spots between tape and component are observed, we already bake material to se if is humidity, is not. We already apply
Electronics Forum | Thu Jan 03 02:35:18 EST 2002 | ianccy
Hi, I am trying to write SOP about the baking requirement of some CSP and uBGA components, the label on the packing said its usable within 72 hours and follow the MSL 4 condition, what does the MSL means? is it Material Safety Level? Has anything to
Electronics Forum | Thu Jan 03 02:36:04 EST 2002 | ianccy
Hi, I am trying to write SOP about the baking requirement of some CSP and uBGA components, the label on the packing said its usable within 72 hours and follow the MSL 4 condition, what does the MSL means? is it Material Safety Level? Has anything to
Electronics Forum | Thu Sep 03 22:03:32 EDT 2020 | SMTA-64386139
Both conditions are acceptable for this bottom brazed flat pack package. The solder coverage must be within 0.070 inch of the lead/package interface per MIL-PRF-38535, paragraph A3.5.6.3.4.a. While that requirement could allow for a gold gap near t
Electronics Forum | Tue Sep 14 06:08:46 EDT 2004 | sc
The general control on QFP fine-pitch coplanarity is +3mils. suggest to look at the re-use of thrown out component from SMT machine. If the component pack in std pack, then most probably the lifted is due to processing, not incoming as the packaging
Electronics Forum | Thu May 12 10:02:21 EDT 2011 | scotceltic
Our company has it's yearly inventory coming up. (Joy). I was wondering if anyone has come across a component counter that can handle radial components in AMMO pack. I have seen plenty out there that can handle counting of radial components in Reel
Electronics Forum | Thu Feb 22 21:01:12 EST 2001 | davef
We don't do this, but if we had to and lacking better advice, for all components I�d dry pack according to J-STD-033, store in a low temperature and humidity controlled environment [maybe using some semicon fab inert storage cabinets], review the eff
Electronics Forum | Mon Jan 25 18:15:39 EST 1999 | Joe
Greetings, We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? What about those components which come on blister tape, should they get baked and re-packed
